SBVS298B September   2017  – July 2018 TPS7A53-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Powering RF Components
      2.      Output Voltage Noise vs Frequency and Output Voltage
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Regulation Features
        1. 7.3.1.1 DC Regulation
        2. 7.3.1.2 AC and Transient Response
      2. 7.3.2 System Start-Up Features
        1. 7.3.2.1 Programmable Soft Start (NR/SS Pin)
        2. 7.3.2.2 Internal Sequencing
          1. 7.3.2.2.1 Enable (EN)
          2. 7.3.2.2.2 Undervoltage Lockout (UVLO) Control
          3. 7.3.2.2.3 Active Discharge
        3. 7.3.2.3 Power-Good Output (PG)
      3. 7.3.3 Internal Protection Features
        1. 7.3.3.1 Foldback Current Limit (ICL)
        2. 7.3.3.2 Thermal Protection (Tsd)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Regulation
      2. 7.4.2 Disabled
      3. 7.4.3 Current Limit Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Recommended Capacitor Types
        1. 8.1.1.1 Input and Output Capacitor Requirements (CIN and COUT)
        2. 8.1.1.2 Noise-Reduction and Soft-Start Capacitor (CNR/SS)
        3. 8.1.1.3 Feed-Forward Capacitor (CFF)
      2. 8.1.2  Soft Start and Inrush Current
      3. 8.1.3  Optimizing Noise and PSRR
      4. 8.1.4  Charge Pump Noise
      5. 8.1.5  Current Sharing
      6. 8.1.6  Adjustable Operation
      7. 8.1.7  Power-Good Operation
      8. 8.1.8  Undervoltage Lockout (UVLO) Operation
      9. 8.1.9  Dropout Voltage (VDO)
      10. 8.1.10 Device Behavior During Transition From Dropout Into Regulation
      11. 8.1.11 Load Transient Response
      12. 8.1.12 Reverse Current Protection Considerations
      13. 8.1.13 Power Dissipation (PD)
      14. 8.1.14 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
      2. 10.1.2 RTK Package — High CTE Mold Compound
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Reference Designs
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGR|20
  • RTK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RGR Package
3.5-mm × 3.5-mm, 20-Pin VQFN
Top View
RTK Package
4-mm × 4-mm, 20-Pin VQFNP
Top View

Pin Functions

PIN DESCRIPTION
NAME NO. I/O
BIAS 12 I BIAS supply voltage. This pin enables the use of low-input voltage, low-output (LILO) voltage conditions (that is, VIN = 1.2 V, VOUT = 1 V) to reduce power dissipation across the die. The use of a BIAS voltage improves dc and ac performance for VIN ≤ 2.2 V. A 10-µF capacitor or larger must be connected between this pin and ground. If not used, this pin must be left floating or tied to ground.
DNC 5 Do not connect. Leave this pin floating or connect this pin to ground.
EN 14 I Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN or BIAS.
FB 3 I Feedback pin connected to the error amplifier. Although not required, a 10-nF feed-forward capacitor from FB to OUT (as close to the device as possible) is recommended to maximize ac performance. The use of a feed-forward capacitor can disrupt PG (power good) functionality.
GND 8, 18 — Ground pin. These pins must be connected to ground, the thermal pad, and each other with a low-impedance connection.
IN 15-17 I Input supply voltage pin. A 10-µF or larger ceramic capacitor (5 µF or greater of capacitance) from IN to ground is recommended to reduce the impedance of the input supply. Place the input capacitor as close to the input as possible.
NC 2, 6, 7, 9, 10, 11 No internal connection
NR/SS 13 — Noise-reduction and soft-start pin. Connecting an external capacitor between this pin and ground reduces reference voltage noise and also enables the soft-start function. Although not required, a 10-nF or larger capacitor is recommended to be connected from NR/SS to GND (as close to the pin as possible) to maximize ac performance.
OUT 1, 19, 20 O Regulated output pin. A 47-µF or larger ceramic capacitor (25 µF or greater of capacitance) from OUT to ground is required for stability and must be placed as close to the output as possible. Minimize the impedance from the OUT pin to the load.
PG 4 O Active-high, power-good pin. An open-drain output indicates when the output voltage reaches VIT(PG) of the target. The use of a feed-forward capacitor may disrupt PG (power good) functionality.
Thermal pad — Connect the thermal pad to a large-area ground plane. The thermal pad is internally connected to GND.