SLVSA98F May   2010  – March 2020 TPS7A65-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Typical Regulator Stability
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Charge-Pump Operation
      3. 7.3.3 Low-Power Mode
      4. 7.3.4 Undervoltage Shutdown
      5. 7.3.5 Low-Voltage Tracking
      6. 7.3.6 Integrated Fault Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN Lower Than 4 V
      2. 7.4.2 Operation With VIN Larger Than 4 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7A65-Q1 UNIT
KVU (TO-252)
3 PINS
RθJA Junction-to-ambient thermal resistance High-K profile(2) 29.3 °C/W
Low-K profile(3) 38.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance N/A °C/W
RθJB Junction-to-board thermal resistance 8.2 °C/W
ψJT Junction-to-top characterization parameter 3.4 °C/W
ψJB Junction-to-board characterization parameter 8.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The thermal data is based on JEDEC standard high-K profile – JESD 51-5. The copper pad is soldered to the thermal land pattern. Also correct attachment procedure must be incorporated.
(3) The thermal data is based on JEDEC standard low-K profile – JESD 51-3. The copper pad is soldered to the thermal land pattern. Also correct attachment procedure must be incorporated.