SBVS370F May   2019  – September 2025 TPS7B81-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Enable (EN)
      2. 6.3.2 Undervoltage Shutdown
      3. 6.3.3 Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation With VIN Lower Than 3V
      2. 6.4.2 Operation With VIN Larger Than 3V
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Dissipation
        1. 7.1.1.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS7B81-Q1 UNIT
DGN
(HVSSOP)		 DRV
(WSON)		 KVU
(TO-252)
8 PINS 6 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 63.9 72.8 31.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.2 85.8 39.9 °C/W
RθJB Junction-to-board thermal resistance 22.6 37.4 9.9 °C/W
ψJT Junction-to-top characterization parameter 1.8 2.7 4.2 °C/W
ψJB Junction-to-board characterization parameter 22.3 37.3 9.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.1 13.8 2.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.