SLVSJH7 October   2025 TPS7E67-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Power-Good (PG)
      4. 6.3.4 Adjustable Power-Good Delay Timer (DELAY)
      5. 6.3.5 Undervoltage Lockout
      6. 6.3.6 Thermal Shutdown
      7. 6.3.7 Foldback Current Limit
      8. 6.3.8 Power Limit
      9. 6.3.9 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistor Selection
      2. 7.1.2 Recommended Capacitor Types
      3. 7.1.3 Input and Output Capacitor Selection
      4. 7.1.4 Reverse Current
      5. 7.1.5 Feed-Forward Capacitor
      6. 7.1.6 Dropout Voltage
      7. 7.1.7 Estimating Junction Temperature
      8. 7.1.8 Power Dissipation (PD)
      9. 7.1.9 Power Dissipation Versus Ambient Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Choose Feedback Resistors
      3. 7.2.3 Setting the Adjustable Power-Good Delay
      4. 7.2.4 Power Supply Recommendations
      5. 7.2.5 Layout
        1. 7.2.5.1 Layout Guidelines
        2. 7.2.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.9 Power Dissipation Versus Ambient Temperature

Figure 7-2 is based off of a JESD51-7 4-layer, high-K board. The allowable power dissipation is estimated using the following equation. As discussed in the An empirical analysis of the impact of board layout on LDO thermal performance application note, thermal dissipation can be improved in the JEDEC high-K layout by adding top layer copper and increasing the number of thermal vias. If a good thermal layout is used, the allowable thermal dissipation can be improved by up to 50%.

Equation 14. T A +   R θ J A     ×   P D     ≤ 150   ℃
TPS7E67-Q1 TPS7E67-Q1 Allowable Power Dissipation Figure 7-2 TPS7E67-Q1 Allowable Power Dissipation