SLVSEN7D april   2019  – may 2023 TPS7H4001-SP

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Options Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - All Devices
    6. 7.6  Electrical Characteristics: CDFP and KGD Options
    7. 7.7  Electrical Characteristics: HTSSOP (SHP) Option
    8. 7.8  Electrical Characteristics: HTSSOP (QMLP) Option
    9. 7.9  Quality Conformance Inspection
    10. 7.10 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  Voltage Reference
      3. 8.3.3  Adjusting the Output Voltage
      4. 8.3.4  Safe Start-Up Into Prebiased Outputs
      5. 8.3.5  Error Amplifier
      6. 8.3.6  Enable and Adjust UVLO
      7. 8.3.7  Adjustable Switching Frequency and Synchronization (SYNC)
        1. 8.3.7.1 Internal Oscillator Mode
        2. 8.3.7.2 External Synchronization Mode
        3. 8.3.7.3 Primary-Secondary Operation Mode
      8. 8.3.8  Soft-Start (SS/TR)
      9. 8.3.9  Power Good (PWRGD)
      10. 8.3.10 Sequencing
      11. 8.3.11 Output Overvoltage Protection (OVP)
      12. 8.3.12 Overcurrent Protection
        1. 8.3.12.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.12.2 Low-Side MOSFET Overcurrent Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Turn-On Behavior
      15. 8.3.15 Slope Compensation
        1. 8.3.15.1 Slope Compensation Requirements
      16. 8.3.16 Small Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fixed-Frequency PWM Control
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Operating Frequency
        2. 9.2.2.2 Output Inductor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Input Capacitor Selection
        5. 9.2.2.5 Soft-Start Capacitor Selection
        6. 9.2.2.6 Undervoltage Lockout (UVLO) Set Point
        7. 9.2.2.7 Output Voltage Feedback Resistor Selection
          1. 9.2.2.7.1 Minimum Output Voltage
        8. 9.2.2.8 Compensation Component Selection
      3. 9.2.3 Parallel Operation
      4. 9.2.4 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDW|44
  • KGD|0
  • HKY|34
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  • Layout is a critical portion of good power supply design. See the Layout Example section for a PCB layout example.
  • It is recommended to include a large topside area filled with ground. This top layer ground area should be connected to the internal ground layer(s) using vias at the input bypass capacitor, the output filter capacitor, and directly under the TPS7H4001-SP device to provide a thermal path from the exposed thermal pad land to ground. For operation at full rated load, the top side ground area together with the internal ground plane must provide adequate heat dissipating area.
  • The GND pin should be tied directly to the thermal pad under the IC.
  • There are several signals paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help eliminate these problems, the PVIN pin should be bypassed to ground with a low ESR ceramic bypass capacitor with X5R or X7R dielectric.
  • Care should be taken to minimize the loop area formed by the bypass capacitor connections, the PVIN pins, and the ground connections.
  • The VIN pin must also be bypassed to ground using a low ESR ceramic capacitor with X5R or X7R dielectric. Make sure to connect this capacitor to the quieter analog ground trace rather than the power ground trace of the PVIN bypass capacitor.
  • Since the PH connection is the switching node, the output inductor should be located close to the PH pins and the area of the PCB conductor minimized to prevent excessive capacitive coupling.
  • The output filter capacitor ground should use the same power ground trace as the PVIN input bypass capacitor. Try to minimize this conductor length while maintaining adequate width.
  • It is critical to keep the feedback trace away from inductor EMI and other noise sources. Run the feedback trace as far from the inductor, phase (PH) node, and noisy power traces as possible. Avoid routing this trace directly under the output inductor if possible. If not possible, ensure that the trace is routed on another layer with a ground layer separating the trace and inductor.
  • Keep the resistive divider used to generate VSENSE voltage as close to the device pin as possible in order to reduce noise pickup.
  • The RT and COMP pins are sensitive to noise as well, so components around these pins should be located as close as possible to the IC and routed with minimal lengths of trace.
  • Make all of the power (high current) traces as short, direct, and thick as possible.
  • It may be possible to obtain acceptable performance with alternate PCB layouts, however this layout has been shown to produce good results and is meant as a guideline.