SLVSCN4D October   2014  – June 2019 TPS82084 , TPS82085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1. 1.8 V Output Application
      2. 1.8 V Output Efficiency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode (PSM)
      2. 7.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 7.3.3 Soft Startup
      4. 7.3.4 Switch Current Limit and Short Circuit Protection (Hiccup-Mode)
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
      2. 7.4.2 Power Good Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.2-V Output Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Setting the Output Voltage
          2. 8.2.1.2.2 Input and Output Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS82084/5SIL
(JEDEC 51-5)		 TPS82085EVM-672
UNIT
RθJA Junction-to-ambient thermal resistance 64.6 46.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.1 n/a(2)
RθJB Junction-to-board thermal resistance 23.5 n/a(2)
ψJT Junction-to-top characterization parameter 0.1 0.1
ψJB Junction-to-board characterization parameter 23.3 24.6
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.2 15.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
(2) Not applicable to an EVM