SNVSBZ5 March   2021 TPS92360

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start-Up
      2. 7.3.2 Open LED Protection
      3. 7.3.3 Shutdown
      4. 7.3.4 Current Program
      5. 7.3.5 LED Brightness Dimming
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Thermal Foldback and Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with CTRL
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Schottky Diode Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 LED Current Set Resistor
        5. 8.2.2.5 Thermal Considerations
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.5 Thermal Considerations

The allowable IC junction temperature must be considered under normal operating conditions. This restriction limits the power dissipation of the TPS92360. The allowable power dissipation for the device can be determined by Equation 7:

Equation 7. GUID-87BDB3A0-8F75-4F70-B8BF-4CF858E900F1-low.gif

where

  • TJ is allowable junction temperature given in recommended operating conditions
  • TA is the ambient temperature for the application
  • RθJA is the thermal resistance junction-to-ambient given in Power Dissipation Table

The TPS92360 device also features a thermal foldback function to reduce the thermal stress automatically.