SLUSCV5 May   2022 TPS92643-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Internal Regulator
      2. 7.3.2  Buck Converter Switching Operation
      3. 7.3.3  Bootstrap Supply
      4. 7.3.4  Switching Frequency and Adaptive On-Time Control
      5. 7.3.5  Minimum On-Time, Off-Time, and Inductor Ripple
      6. 7.3.6  LED Current Regulation and Error Amplifier
      7. 7.3.7  Start-Up Sequence
      8. 7.3.8  Analog Dimming and Forced Continuous Conduction Mode
      9. 7.3.9  External PWM Dimming and Input Undervoltage Lockout (UVLO)
      10. 7.3.10 Analog Pulse Width Modulator Circuit
      11. 7.3.11 Output Short and Open-Circuit Faults
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Fault Indicator and Diagnostics Summary
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Duty Cycle Considerations
      2. 8.1.2  Switching Frequency Selection
      3. 8.1.3  LED Current Programming
      4. 8.1.4  Inductor Selection
      5. 8.1.5  Output Capacitor Selection
      6. 8.1.6  Input Capacitor Selection
      7. 8.1.7  Bootstrap Capacitor Selection
      8. 8.1.8  Bootstrap Resistor Selection
      9. 8.1.9  Compensation Capacitor Selection
      10. 8.1.10 Input Dropout and Undervoltage Protection
      11. 8.1.11 APWM Input and Thermal Protection
      12. 8.1.12 Protection Diodes
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Calculating Duty Cycle
        2. 8.2.2.2  Calculating Minimum On-Time and Off-Time
        3. 8.2.2.3  Minimum Switching Frequency
        4. 8.2.2.4  LED Current Set Point
        5. 8.2.2.5  Inductor Selection
        6. 8.2.2.6  Output Capacitor Selection
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Bootstrap Resistor Selection
        9. 8.2.2.9  Compensation Capacitor Selection
        10. 8.2.2.10 VIN Dropout Protection and PWM Dimming
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
        1. 10.1.1.1 Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input Voltage VIN –0.3 36 V
VIN (< 400 ms) 40 V
Bias supply voltage, VCC VVCC –0.3 5.5 V
Boot voltage, BST BST to SW –0.3 5.5 V
BST to GND –0.3 41.5 V
Switch node voltage VSW to GND –0.5 36 V
VSW to GND (< 400 ms) –0.5 40 V
VSW to GND (< 10 ns) –3.5 40 V
Inputs CSP, CSN –0.5 36 V
RON –0.1 36 V
IRON 500 µA
V(CSP-CSN) –0.3 0.3 mV
UDIM to GND –0.3 VVIN V
IADJ –0.1 5.5 V
COMP, APWM –0.3 5.5 V
Outputs FLT –0.3 20 V
Ground PGND to AGND –0.5 0.5 V
PGND to AGND (< 10 ns) –3.5 3.5 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –40 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.