SLIS178B October   2017  – January 2018 TPS92830-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Bias
        1. 8.3.1.1 Power-On-Reset (POR)
        2. 8.3.1.2 Current Reference (IREF)
        3. 8.3.1.3 Low-Current Fault Mode
      2. 8.3.2 Charge Pump
        1. 8.3.2.1 Charge Pump Architecture
      3. 8.3.3 Constant-Current Driving
        1. 8.3.3.1 High-Side Current Sense
        2. 8.3.3.2 High-Side Current Driving
        3. 8.3.3.3 Gate Overdrive Voltage Protection
        4. 8.3.3.4 High-Precision Current Regulation
        5. 8.3.3.5 Parallel MOSFET Driving
      4. 8.3.4 PWM Dimming
        1. 8.3.4.1 Supply Dimming
        2. 8.3.4.2 PWM Dimming by Input
        3. 8.3.4.3 Internal Precision PWM Generator
        4. 8.3.4.4 Full Duty-Cycle Switch
      5. 8.3.5 Analog Dimming
        1. 8.3.5.1 Analog Dimming Topology
        2. 8.3.5.2 Internal High-Precision Pullup Current Source
      6. 8.3.6 Output Current Derating
        1. 8.3.6.1 Output-Current Derating Topology
      7. 8.3.7 Diagnostics and Fault
        1. 8.3.7.1 LED Short-to-GND Detection
        2. 8.3.7.2 LED Short-to-GND Auto Retry
        3. 8.3.7.3 LED Open-Circuit Detection
        4. 8.3.7.4 LED Open-Circuit Auto Retry
        5. 8.3.7.5 Dropout-Mode Diagnostics
        6. 8.3.7.6 Overtemperature Protection
        7. 8.3.7.7 FAULT Bus Output With One-Fails–All-Fail
        8. 8.3.7.8 Fault Table
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout, V(IN) < V(UVLO)
      2. 8.4.2 Normal Operation (V(IN) ≥ 4.5 V, V(IN) > V(LED) + 0.5 V)
      3. 8.4.3 Low-Voltage Dropout
      4. 8.4.4 Fault Mode (Fault Is Detected)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for Automotive Exterior Lighting With One-Fails–All-Fail
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 High-Precision Dual-Brightness PWM Generation
        1. 9.2.2.1 Dual-Brightness Application
        2. 9.2.2.2 Design Requirements
        3. 9.2.2.3 Detailed Design Procedure
        4. 9.2.2.4 Application Curve
      3. 9.2.3 Driving High-Current LEDs With Parallel MOSFETs
        1. 9.2.3.1 Application Curves
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The TPS92830-Q1 device relies on external MOSFETs to dissipate heat for high-current applications. To effectively dissipate heat on MOSFETs and LEDs, TI recommends to use 0.071-mm-thick (2-oz.) copper PCBs or metal-based boards. Make the thermal dissipation area with copper as large as possible. Place thermal vias on the thermal dissipation area to further improve the thermal dissipation capability. The current path starts from IN through the sense-resistors, MOSFETs, and LEDs to GND. Wide traces are helpful to reduce parasitic resistance along the current path as shown in the layout example below.

Place capacitors, especially charge pump capacitors, close to the device to make the current path as short as possible. TI suggests keeping the LED high-current ground path separate from device ground. TI also recommends kelvin-connection to the connector. The following layout example shows the recommended guidelines.