DLPS039F December   2015  – April 2019 TPS99000-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Standalone System
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions - Initialization, Clock, and Diagnostics
    2.     Pin Functions - Power and Ground
    3.     Pin Functions - Power Supply Management
    4.     Pin Functions - Illumination Control
    5.     Pin Functions - Serial Peripheral Interfaces
    6.     Pin Functions - Analog to Digital Converter
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Transimpedance Amplifier Parameters
    6. 6.6  Electrical Characteristics - Digital to Analog Converters
    7. 6.7  Electrical Characteristics - Analog to Digital Converter
    8. 6.8  Electrical Characteristics - FET Gate Drivers
    9. 6.9  Electrical Characteristics - Photo Comparator
    10. 6.10 Electrical Characteristics - Voltage Regulators
    11. 6.11 Electrical Characteristics - Temperature and Voltage Monitors
    12. 6.12 Electrical Characteristics - Current Consumption
    13. 6.13 Power-Up Timing Requirements
    14. 6.14 Power-Down Timing Requirements
    15. 6.15 Timing Requirements - Sequencer Clock
    16. 6.16 Timing Requirements - Host / Diagnostic Port SPI Interface
    17. 6.17 Timing Requirements - ADC Interface
    18. 6.18 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Illumination Control
        1. 7.3.1.1 Illumination System High Dynamic Range Dimming Overview
        2. 7.3.1.2 Illumination Control Loop
        3. 7.3.1.3 Continuous Mode Operation
          1. 7.3.1.3.1 Output Capacitance in Continuous Mode
          2. 7.3.1.3.2 Continuous Mode Driver Distortion and Blanking Current
          3. 7.3.1.3.3 Continuous Mode S_EN2 Dissipative Load Shunt Options
          4. 7.3.1.3.4 Continuous Mode Constant OFF Time
          5. 7.3.1.3.5 Continuous Mode Current Limit
        4. 7.3.1.4 Discontinuous Mode Operation
          1. 7.3.1.4.1 Discontinuous Mode Pulse Width Limit
          2. 7.3.1.4.2 COMPOUT_LOW Timer in Discontinuous Operation
          3. 7.3.1.4.3 Dimming Within Discontinuous Operation Range
          4. 7.3.1.4.4 Multiple Pulse Heights to Increase Bit Depth
          5. 7.3.1.4.5 TIA Gain Adjustment
          6. 7.3.1.4.6 Current Limit in Discontinuous Mode
          7. 7.3.1.4.7 CMODE Big Cap Mode in Discontinuous Operation
      2. 7.3.2 Over-Brightness Detection
        1. 7.3.2.1 Photo Feedback Monitor BIST
        2. 7.3.2.2 Excessive Brightness BIST
      3. 7.3.3 Analog to Digital Converter
        1. 7.3.3.1 Analog to Digital Converter Input Table
      4. 7.3.4 Power Sequencing and Monitoring
        1. 7.3.4.1 Power Monitoring
      5. 7.3.5 DMD Mirror Voltage Regulator
      6. 7.3.6 Low Dropout Regulators
      7. 7.3.7 System Monitoring Features
        1. 7.3.7.1 Windowed Watchdog Circuits
        2. 7.3.7.2 Die Temperature Monitors
        3. 7.3.7.3 External Clock Ratio Monitor
      8. 7.3.8 Communication Ports
        1. 7.3.8.1 Serial Peripheral Interface (SPI)
    4. 7.4 Device Functional Modes
      1. 7.4.1 OFF
      2. 7.4.2 STANDBY
      3. 7.4.3 POWERING_DMD
      4. 7.4.4 DISPLAY_RDY
      5. 7.4.5 DISPLAY_ON
      6. 7.4.6 PARKING
      7. 7.4.7 SHUTDOWN
    5. 7.5 Register Maps
      1. 7.5.1 System Status Registers
      2. 7.5.2 ADC Control
      3. 7.5.3 General Fault Status
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HUD
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Application Design Considerations
          1. 8.2.1.2.1 Photodiode Considerations
          2. 8.2.1.2.2 LED Current Measurement
          3. 8.2.1.2.3 Setting the Current Limit
          4. 8.2.1.2.4 Input Voltage Variation Impact
          5. 8.2.1.2.5 Discontinuous Mode Photo Feedback Considerations
          6. 8.2.1.2.6 Transimpedance Amplifiers (TIAs, Usage, Offset, Dark Current, Ranges, RGB Trim)
      2. 8.2.2 Headlight
        1. 8.2.2.1 Design Requirements
  9. 9 Power Supply Recommendations
    1. 9.1 TPS99000-Q1 Power Supply Architecture
    2. 9.2 TPS99000-Q1 Power Outputs
    3. 9.3 Power Supply Architecture
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power/High Current Signals
      2. 10.1.2 Sensitive Analog Signals
      3. 10.1.3 High Speed Digital Signals
      4. 10.1.4 High Power Current Loops
      5. 10.1.5 Kelvin Sensing Connections
      6. 10.1.6 Ground Separation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Tape and Reel Information
      2. 12.1.2 Mechanical Drawings

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.6 Ground Separation

Separated ground planes are good for isolating noise from different parts of the circuit to other. However, when designing with separate ground planes, one must be careful of how the signals are routed to avoid large inductive loops. If separate ground planes are used, TI recommends the following ground connections to the TPS99000-Q1. In addition, the grounds should be connected electrically by a via or 0 Ω resistor. If a unified ground plane is used, the following can be used as a guideline for which groups of signals should be routed apart from other signals.

Table 13. TPS99000-Q1 Ground Separation

PIN NAME GROUND
13, 35 VSS_IO Digital
24 DVSS Digital
25, 60, 75, 99 PBKG Analog
48 VSS_DRVR Power
53 DRST_PGND Power
56 VSS_DRST Power
66 GND_LDO Analog
71, 72 VSS_TIA Analog
78, 100 AVSS Analog
81, 84, 87, 89, 91 VSSL_ADC Analog
Thermal Pad DAP Analog