SNVSBT8 March   2021 TPSM13604H

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 COT Control Circuit Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Comparator
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Zero Coil Current Detection
      5. 7.3.5 Prebiased Start-up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Design Steps for the TPSM13604 Application
          1. 8.2.2.1.1 Enable Divider, RENT, and RENB Selection
          2. 8.2.2.1.2 Output Voltage Selection
          3. 8.2.2.1.3 Soft-Start Capacitor, CSS, Selection
          4. 8.2.2.1.4 Output Capacitor, CO, Selection
            1. 8.2.2.1.4.1 Capacitance
            2. 8.2.2.1.4.2 ESR
          5. 8.2.2.1.5 Input Capacitor, CIN, Selection
          6. 8.2.2.1.6 ON-Time, RON, Resistor Selection
            1. 8.2.2.1.6.1 Discontinuous Conduction and Continuous Conduction Mode Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Module SMT Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Power Dissipation and Board Thermal Requirements
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Glossary
    7. 11.7 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Power Module SMT Guidelines

The following recommendations are for a standard module surface mount assembly:

  • Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads.
  • Stencil Aperture
    • For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land pattern.
    • For all other I/O pads, use a 1:1 ratio between the aperture and the land pattern recommendation.
  • Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher.
  • Stencil Thickness – 0.125 mm to 0.15 mm
  • Reflow - Refer to solder paste supplier recommendation and optimized per board size and density.
  • Refer to AN Design Summary LMZ1xxx and LMZ2xxx Power Modules Family for reflow information.
  • Maximum number of reflows allowed is one.
GUID-D8D92394-E852-4276-96DF-83F62F0EF744-low.pngFigure 10-1 Sample Reflow Profile
Table 10-1 Sample Reflow Profile Table
PROBEMAX TEMP (°C)REACHED MAX TEMPTIME ABOVE 235°CREACHED 235°CTIME ABOVE 245°CREACHED 245°CTIME ABOVE 260°CREACHED 260°C
1242.56.580.496.390–0–
2242.57.10.556.3107.10–
32417.090.426.440–0–