SNVSC83B September   2022  – February 2023 TPSM365R3 , TPSM365R6

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  System Characteristics
    7. 8.7  Typical Characteristics
    8. 8.8  Typical Characteristics: VIN = 12 V
    9. 8.9  Typical Characteristics: VIN = 24 V
    10. 8.10 Typical Characteristics: VIN = 48 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Input Voltage Range
      2. 9.3.2  Output Voltage Selection
      3. 9.3.3  Input Capacitors
      4. 9.3.4  Output Capacitors
      5. 9.3.5  Enable, Start-Up, and Shutdown
      6. 9.3.6  External CLK SYNC (with MODE/SYNC)
        1. 9.3.6.1 Pulse-Dependent MODE/SYNC Pin Control
      7. 9.3.7  Switching Frequency (RT)
      8. 9.3.8  Power-Good Output Operation
      9. 9.3.9  Internal LDO, VCC UVLO, and BIAS Input
      10. 9.3.10 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      11. 9.3.11 Spread Spectrum
      12. 9.3.12 Soft Start and Recovery from Dropout
        1. 9.3.12.1 Recovery from Dropout
      13. 9.3.13 Overcurrent Protection (OCP)
      14. 9.3.14 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Active Mode
        1. 9.4.3.1 CCM Mode
        2. 9.4.3.2 AUTO Mode - Light Load Operation
          1. 9.4.3.2.1 Diode Emulation
          2. 9.4.3.2.2 Frequency Reduction
        3. 9.4.3.3 FPWM Mode - Light Load Operation
        4. 9.4.3.4 Minimum On-time (High Input Voltage) Operation
      4. 9.4.4 Dropout
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 600-mA and 300-mA Synchronous Buck Regulator for Industrial Applications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 10.2.1.2.2  Output Voltage Setpoint
          3. 10.2.1.2.3  Switching Frequency Selection
          4. 10.2.1.2.4  Input Capacitor Selection
          5. 10.2.1.2.5  Output Capacitor Selection
          6. 10.2.1.2.6  VCC
          7. 10.2.1.2.7  CFF Selection
          8. 10.2.1.2.8  Power-Good Signal
          9. 10.2.1.2.9  Maximum Ambient Temperature
          10. 10.2.1.2.10 Other Connections
        3. 10.2.1.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Ground and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Development Support
        1. 11.1.3.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.13 Overcurrent Protection (OCP)

The TPSM365Rx is protected from overcurrent conditions by using cycle-by-cycle current limiting circuitry on both the high-side and low-side MOSFETs. The current is compared every switching cycle to the current limit threshold. During an overcurrent condition, the output voltage decreases.

High-side MOSFET overcurrent protection is implemented by the typical peak-current mode control scheme. The HS switch current is sensed when the HS is turned on after a short blanking time. The HS switch current is compared to either the minimum of a fixed current set point or the output of the internal error amplifier loop minus the slope compensation every switching cycle. Because the output of the internal error amplifier loop has a maximum value and slope compensation increases with duty cycle, HS current limit decreases with increased duty factor if duty factor is typically above 35%.

When the LS switch is turned on, the current going through it is also sensed and monitored. Like the high-side device, the low-side device has a turnoff commanded by the internal error amplifier loop. In the case of the lowside device, turn-off is prevented if the current exceeds this value, even if the oscillator normally starts a new switching cycle. Also like the high-side device, there is a limit on how high the turn-off current is allowed to be. This is called the low-side current limit. If the LS current limit is exceeded, the LS MOSFET stays on and the HS switch is not to be turned on. The LS switch is turned off after the LS current falls below this limit and the HS switch is turned on again as long as at least one clock period has passed since the last time the HS device has turned on.