SNVSC83C September   2022  – October 2025 TPSM365R3 , TPSM365R6

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  System Characteristics
    7. 6.7  Typical Characteristics
    8. 6.8  Typical Characteristics: VIN = 12 V
    9. 6.9  Typical Characteristics: VIN = 24 V
    10. 6.10 Typical Characteristics: VIN = 48 V
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Output Voltage Selection
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Enable, Start-Up, and Shutdown
      6. 7.3.6  External CLK SYNC (with MODE/SYNC)
        1. 7.3.6.1 Pulse-Dependent MODE/SYNC Pin Control
      7. 7.3.7  Switching Frequency (RT)
      8. 7.3.8  Power-Good Output Operation
      9. 7.3.9  Internal LDO, VCC UVLO, and BIAS Input
      10. 7.3.10 Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      11. 7.3.11 Spread Spectrum
      12. 7.3.12 Soft Start and Recovery from Dropout
        1. 7.3.12.1 Recovery from Dropout
      13. 7.3.13 Overcurrent Protection (OCP)
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 AUTO Mode - Light Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode - Light Load Operation
        4. 7.4.3.4 Minimum On-time (High Input Voltage) Operation
      4. 7.4.4 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 600-mA and 300-mA Synchronous Buck Regulator for Industrial Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Output Voltage Setpoint
          3. 8.2.1.2.3  Switching Frequency Selection
          4. 8.2.1.2.4  Input Capacitor Selection
          5. 8.2.1.2.5  Output Capacitor Selection
          6. 8.2.1.2.6  VCC
          7. 8.2.1.2.7  CFF Selection
          8. 8.2.1.2.8  Power-Good Signal
          9. 8.2.1.2.9  Maximum Ambient Temperature
          10. 8.2.1.2.10 Other Connections
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Ground and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Device Nomenclature
      3. 9.1.3 Development Support
        1. 9.1.3.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1.3 Application Curves

Unless otherwise indicated, VIN = 24 V, VOUT = 5 V, IOUT = 0.5 A, and FSW = 1 MHz

TPSM365R3 TPSM365R6 Start-Up Waveforms
VIN = 24 V VOUT = 5 V
Figure 8-3 Start-Up Waveforms
TPSM365R3 TPSM365R6 Load Transient, 0 A to 0.6 A, 1 A/µs
VIN = 24 V VOUT = 3.3 V FSW = 1 MHz
COUT = 2 × 22 µF
Figure 8-5 Load Transient, 0 A to 0.6 A, 1 A/µs
TPSM365R3 TPSM365R6 Load Transient, 0 A to 0.6 A, 1 A/µs
VIN = 24 V VOUT = 5 V FSW = 1 MHz
COUT = 2 × 22 µF
Figure 8-7 Load Transient, 0 A to 0.6 A, 1 A/µs
TPSM365R3 TPSM365R6 Thermal Image, VIN = 24 V, VOUT = 12 V, FSW = 2.2 MHz, IOUT = 0.6 A (Standard EVM and BOM)Figure 8-9 Thermal Image, VIN = 24 V, VOUT = 12 V, FSW = 2.2 MHz, IOUT = 0.6 A (Standard EVM and BOM)
TPSM365R3 TPSM365R6 Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz with EMI Filter (Standard EVM Layout and BOM)
VIN = 24 V VOUT = 5 V fSW = 1 MHz
Load = 500 mA
Figure 8-11 Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz with EMI Filter (Standard EVM Layout and BOM)
TPSM365R3 TPSM365R6 Typical CISPR 11 Class B Radiated EMI 30 kHz - 1000 MHz (Standard EVM Layout and BOM, Input Filter Removed)
VIN = 24 V VOUT = 5 V fSW = 1 MHz
Load = 500 mA
Figure 8-13 Typical CISPR 11 Class B Radiated EMI 30 kHz - 1000 MHz (Standard EVM Layout and BOM, Input Filter Removed)
TPSM365R3 TPSM365R6 Shutdown Waveforms
VIN = 24 V VOUT = 5 V
Figure 8-4 Shutdown Waveforms
TPSM365R3 TPSM365R6 Load Transient, 0.3 A to 0.6 A, 1 A/µs
VIN = 24 V VOUT = 3.3 V FSW = 1 MHz
COUT = 2 × 22 µF
Figure 8-6 Load Transient, 0.3 A to 0.6 A, 1 A/µs
TPSM365R3 TPSM365R6 Load Transient, 0.3 A to 0.6 A, 1 A/µs
VIN = 24 V VOUT = 5 V F SW = 1 MHz
COUT = 2 × 22 µF
Figure 8-8 Load Transient, 0.3 A to 0.6 A, 1 A/µs
TPSM365R3 TPSM365R6 Thermal Image, VIN = 24 V, VOUT = 5 V, FSW = 1 MHz, IOUT = 0.6 A (Standard EVM and BOM)Figure 8-10 Thermal Image, VIN = 24 V, VOUT = 5 V, FSW = 1 MHz, IOUT = 0.6 A (Standard EVM and BOM)
TPSM365R3 TPSM365R6 Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz without EMI Filter (Standard EVM Layout and BOM)
VIN = 24 V VOUT = 5 V fSW = 1 MHz
Load = 500 mA
Figure 8-12 Typical CISPR 11 Class B Conducted EMI 150 kHz - 30 MHz without EMI Filter (Standard EVM Layout and BOM)