SLVSGL3 April   2022 TPSM63603E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  System Characteristics
    7. 7.7  Typical Characteristics
    8. 7.8  Typical Characteristics — VIN = 12 V
    9. 7.9  Typical Characteristics — VIN = 24 V
    10. 7.10 Typical Characteristics — VIN = 36 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range
      2. 8.3.2  Adjustable Output Voltage (FB)
      3. 8.3.3  Input Capacitors
      4. 8.3.4  Output Capacitors
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Output ON and OFF Enable (EN/SYNC) and VIN UVLO
      7. 8.3.7  Frequency Synchronization (EN/SYNC)
      8. 8.3.8  Spread Spectrum
      9. 8.3.9  Power-Good Monitor (PG)
      10. 8.3.10 Adjustable Switch-Node Slew Rate (RBOOT and CBOOT)
      11. 8.3.11 Internal LDO, VCC Output, and VLDOIN Input
      12. 8.3.12 Overcurrent Protection (OCP)
      13. 8.3.13 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 — 3-A Synchronous Buck Regulator for Industrial Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Output Voltage Setpoint
          3. 9.2.1.2.3 Switching Frequency Selection
          4. 9.2.1.2.4 Input Capacitor Selection
          5. 9.2.1.2.5 Output Capacitor Selection
          6. 9.2.1.2.6 Other Connections
        3. 9.2.1.3 Application Curves
        4. 9.2.1.4 Design 2 — Inverting Buck-Boost Regulator with a –5-V Output
          1. 9.2.1.4.1 Design Requirements
          2. 9.2.1.4.2 Detailed Design Procedure
            1. 9.2.1.4.2.1 Output Voltage Setpoint
            2. 9.2.1.4.2.2 IBB Maximum Output Current
            3. 9.2.1.4.2.3 Switching Frequency Selection
            4. 9.2.1.4.2.4 Input Capacitor Selection
            5. 9.2.1.4.2.5 Output Capacitor Selection
            6. 9.2.1.4.2.6 Other Connections
            7. 9.2.1.4.2.7 EMI
              1. 9.2.1.4.2.7.1 EMI Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Package Specifications
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.1.4.2.6 Other Connections

Short RBOOT to CBOOT and connect VLDOIN to VOUT for the best efficiency.

Place a 1-µF capacitor between the VCC pin and PGND, located near to the device.

The right-half-plane zero of an IBB topology is at its lowest frequency at minimum input voltage. However, it does not appear at low frequency for a –5-V output and has minimal effect on the loop response for this application.

In an inverting buck-boost configuration, the input capacitor, CIN, and output capacitor, COUT, can form an AC capacitive divider during a fast VIN transient or hot-plugged event at the input. This event will result in a positive voltage spike at the output that can disturb the load. In this case, an optional Schottky diode can be installed between –VOUT and GND as shown in Figure 9-12 to clamp the output spike.