SLVSGL3 April   2022 TPSM63603E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  System Characteristics
    7. 7.7  Typical Characteristics
    8. 7.8  Typical Characteristics — VIN = 12 V
    9. 7.9  Typical Characteristics — VIN = 24 V
    10. 7.10 Typical Characteristics — VIN = 36 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range
      2. 8.3.2  Adjustable Output Voltage (FB)
      3. 8.3.3  Input Capacitors
      4. 8.3.4  Output Capacitors
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Output ON and OFF Enable (EN/SYNC) and VIN UVLO
      7. 8.3.7  Frequency Synchronization (EN/SYNC)
      8. 8.3.8  Spread Spectrum
      9. 8.3.9  Power-Good Monitor (PG)
      10. 8.3.10 Adjustable Switch-Node Slew Rate (RBOOT and CBOOT)
      11. 8.3.11 Internal LDO, VCC Output, and VLDOIN Input
      12. 8.3.12 Overcurrent Protection (OCP)
      13. 8.3.13 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 — 3-A Synchronous Buck Regulator for Industrial Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Output Voltage Setpoint
          3. 9.2.1.2.3 Switching Frequency Selection
          4. 9.2.1.2.4 Input Capacitor Selection
          5. 9.2.1.2.5 Output Capacitor Selection
          6. 9.2.1.2.6 Other Connections
        3. 9.2.1.3 Application Curves
        4. 9.2.1.4 Design 2 — Inverting Buck-Boost Regulator with a –5-V Output
          1. 9.2.1.4.1 Design Requirements
          2. 9.2.1.4.2 Detailed Design Procedure
            1. 9.2.1.4.2.1 Output Voltage Setpoint
            2. 9.2.1.4.2.2 IBB Maximum Output Current
            3. 9.2.1.4.2.3 Switching Frequency Selection
            4. 9.2.1.4.2.4 Input Capacitor Selection
            5. 9.2.1.4.2.5 Output Capacitor Selection
            6. 9.2.1.4.2.6 Other Connections
            7. 9.2.1.4.2.7 EMI
              1. 9.2.1.4.2.7.1 EMI Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Package Specifications
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) RDH (QFN) UNIT
30 PINS
RθJA Junction-to-ambient thermal resistance (TPSM63603 EVM) 29.1 °C/W
RθJA Junction-to-ambient thermal resistance(2) 33.5 °C/W
ψJT Junction-to-top characterization parameter(3) 4.1 °C/W
ψJB Junction-to-board characterization parameter(4) 21.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 64-mm × 83-mm four-layer PCB with 2-oz. copper and natural convection cooling. Additional airflow and PCB copper area reduces RθJA. For more information see the Layout section.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1 mm from the device.