SLLSFO5A November   2021  – September 2022 TRSF3243E

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: Driver
    8. 6.8  Switching Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Switching Characteristics: Receiver
    11. 6.11 Electrical Characteristics: Auto-Powerdown
    12. 6.12 Switching Characteristics: Auto-Powerdown
      1.      Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2.     Functional Block Diagram
    3. 7.2 Feature Description
    4. 7.3 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1.      Device and Documentation Support
        1. 11.1 Receiving Notification of Documentation Updates
        2. 11.2 Support Resources
        3. 11.3 Trademarks
        4. 11.4 Electrostatic Discharge Caution
        5. 11.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.