SLLSFO5A November   2021  – September 2022 TRSF3243E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: Driver
    8. 6.8  Switching Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Switching Characteristics: Receiver
    11. 6.11 Electrical Characteristics: Auto-Powerdown
    12. 6.12 Switching Characteristics: Auto-Powerdown
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2.     Functional Block Diagram
    3. 7.2 Feature Description
    4. 7.3 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1.      Device and Documentation Support
        1. 11.1 Receiving Notification of Documentation Updates
        2. 11.2 Support Resources
        3. 11.3 Trademarks
        4. 11.4 Electrostatic Discharge Caution
        5. 11.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1) TRSF3243E UNIT
VQFN (RHB) TSSOP (PW)
32 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 34.1 70.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.9 21.0 °C/W
RθJB Junction-to-board thermal resistance 14.6 29.2 °C/W
ψJT Junction-to-top characterization parameter 0.5 1.3 °C/W
ψJB Junction-to-board characterization parameter 14.6 28.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.1 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.