SCDS324E August   2011  – Oct 2019 TS3DS10224

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    6. 6.6  Electrical Characteristics: Fan-Out 1:2 Configurations
    7. 6.7  Switching Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    8. 6.8  Switching Characteristics: Fan-Out 1:2 Configurations
    9. 6.9  Dynamic Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations
    10. 6.10 Dynamic Characteristics: Fan-Out 1:2 Configurations
    11. 6.11 Typical Characteristics
      1. 6.11.1 Single-Channel 1:4 or Dual-Channel 1:2 Configurations
      2. 6.11.2 Fan-Out 1:2 Configurations
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Differential Crosspoint Switch
      3. 8.4.3 2-Channel 1:2 Mux
      4. 8.4.4 1-Channel 1:4 Mux
      5. 8.4.5 Fan-Out 1:2 Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1-Channel Differential 1:4 Mux
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 2-Channel Differential Crosspoint Switch
        1. 9.2.2.1 Design Requirements
      3. 9.2.3 Fan-Out Switch
        1. 9.2.3.1 Design Requirements
      4. 9.2.4 2-Channel Differential 1:2 SPDT Switch
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics: Differential 1:4 or 2‑Channel 1:2 Configurations

Minimum and maximum values are at TA = –40°C to 85°C; typical values are at TA = 25°C (unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK Digital input clamp voltage VCC = 3.6 V, II = –18 mA –1.2 –0.9 V
IIN Digital input leakage current VCC = 3.6 V, VIN = 0 to 3.6 V ±2 µA
IOZ OFF-state leakage current(2) VCC = 3.6 V, VO = 0 V to 3.6 V, VI = 0 V, Switch OFF ±2 µA
IOFF Power off leakage current VCC = 0 V, VIN = VCC or GND,VIO = 0 V to 3.6 V ±5 µA
ICC Supply current VCC = 3.6 V, IIO = 0, Switch ON or OFF 50 100 µA
CIN Digital input capacitance VCC = 3.3 V, VIN = VCC or GND 3 5 pF
CIO(OFF) OFF capacitance VCC = 3.3 V, VIO = 3.3 V or 0, f = 10 MHz, Switch OFF 6 7 pF
CIO(ON) ON capacitance VCC = 3.3 V, VIO = 3.3 V or 0, f = 10 MHz, Switch ON 9 10 pF
rON ON-state resistance VCC = 3.6 V, VI = VCC, IO = –30 mA 13 19 Ω
VCC = 3.3 V, VI = 0.5 V, IO = –30 mA 10 Ω
ΔrON ON-state resistance match between channels VCC = 3 V, VI = 0 to VCC, IO = –30 mA 2 2.5 Ω
rON(flat) ON-state resistance flatness VCC = 3 V, VI = 1.5 V and VCC, IO = –30 mA 4 6 Ω
(1) VIN and IIN refer to the digital control input pins.
(2) For I/O ports, the parameter IOZ includes the input leakage current.