SCDS307D September   2010  – October 2022 TS3L501E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 1000 Base-T Ethernet Switching
    6. 6.6 Electrical Characteristics for 10/100 Base-T Ethernet Switching
    7. 6.7 Switching Characteristics
    8. 6.8 Dynamic Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Enable and Disable Times
    2. 7.2 Skew
    3. 7.3 HP8753ES Setup
    4. 7.4 HP8753ES Setup
    5. 7.5 HP8753ES Setup
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Integrated power-down mode
  • Wide bandwidth (BW = 600 MHz typical)
  • Low crosstalk (XTALK = –37 dB typical
    at 250 MHz)
  • Low bit-to-bit skew (tsk(o) = 100 ps maximum)
  • Low and Flat ON-State Resistance
    (ron = 4 Ω typical, ron(flat) = 0.5 Ω typical)
  • Low input and output capacitance
    (CON = 9 pF typical)
  • Rail-to-rail switching on data I/O ports
    (0 V to 3.6 V)
  • VCC operating range from: 3 V to 3.6 V
  • Support power-down mode
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD performance (A, B, C, and LED pins)
    • ±4-kV IEC61000-4-2, Contact Discharge
    • 6-kV Human Body Model per JESD22-A114E (switch I/O pins to GND)
  • ESD performance (all pins)
    • 2-kV Human Body Model per JESD22-A114E