SCDS242E July   2007  – August 2016 TS3USB31

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 IOFF Supports Partial Power-Down Mode Operation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

2 Applications

    Bus Isolation for USB 1.0, 1.1, and 2.0

3 Description

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TS3USB31 UQFN (8) 1.50 mm × 1.50 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Functional Block Diagram

TS3USB31 analog_sym_cds242.gif