SCDS187C FEBRUARY   2005  – August 2018 TS5A3167

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simple Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 5-V Supply
    6. 6.6  Electrical Characteristics for 5-V Supply (continued)
    7. 6.7  Electrical Characteristics for 3.3-V Supply
    8. 6.8  Electrical Characteristics for 3.3-V Supply (continued)
    9. 6.9  Electrical Characteristics for 2.5-V Supply
    10. 6.10 Electrical Characteristics for 2.5-V Supply (continued)
    11. 6.11 Electrical Characteristics for 1.8-V Supply
    12. 6.12 Electrical Characteristics for 1.8-V Supply (continued)
    13. 6.13 Typical Performance
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Isolation in Powered-Off Mode, VCC = 0
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

TI recommends proper power-supply sequencing for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device. It is recommended that VCC is powered on first, followed by NC or COM but not required because of the Isolation in Powered-Off Mode, VCC = 0 feature.

Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagation from the VCC supply to other components. A 0.1-μF capacitor, connected from VCC to GND, is adequate for most applications.