SLVSEG2B September   2018  – September 2022 TVS3301

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings - JEDEC
    3. 8.3 ESD Ratings - IEC
    4. 8.4 Recommended Operating Conditions
    5. 8.5 Thermal Information
    6. 8.6 Electrical Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Protection Specifications
      2. 9.4.2 Reliability Testing
      3. 9.4.3 Minimal Derating
      4. 9.4.4 Bidirectional Operation
      5. 9.4.5 Transient Performance
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
      4. 10.2.4 PLC Surge Protection Reference Design
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Thermal Information

THERMAL METRIC(1)TVS3301UNIT
DRB (SON)
8 PINS
RqJAJunction-to-ambient thermal resistance52.0°C/W
RqJC(top)Junction-to-case (top) thermal resistance56.1°C/W
RqJBJunction-to-board thermal resistance24.9°C/W
YJTJunction-to-top characterization parameter2.1°C/W
YJBJunction-to-board characterization parameter24.8°C/W
RqJC(bot)Junction-to-case (bottom) thermal resistance9.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.