SCES727A June   2008  – December 2014 TXB0104-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.2 V
    7. 6.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCCA = 1.2 V
    12. 6.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (June 2008) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go