SCES940 February   2022 TXU0101

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions—TXU0101
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Operating Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Control Logic (OE) with VCC(MIN) Circuitry
      3. 8.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 8.3.4 VCC Isolation and VCC Disconnect
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Glitch-Free Power Supply Sequencing
      7. 8.3.7 Negative Clamping Diodes
      8. 8.3.8 Fully Configurable Dual-Rail Design
      9. 8.3.9 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Regulatory Requirements
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

  • Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF capacitor is recommended, but transient performance can be improved by having 1 µF and 0.1 µF capacitors in parallel as bypass capacitors.
  • The high drive capability of this device creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.