SCES940 February   2022 TXU0101

PRODMIX  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions—TXU0101
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Operating Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Control Logic (OE) with VCC(MIN) Circuitry
      3. 8.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 8.3.4 VCC Isolation and VCC Disconnect
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Glitch-Free Power Supply Sequencing
      7. 8.3.7 Negative Clamping Diodes
      8. 8.3.8 Fully Configurable Dual-Rail Design
      9. 8.3.9 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Regulatory Requirements
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TXU0101 UNIT
DBV (SOT-23) DCK (SC70) DRL (SOT-5X3) DRY (SON) DTQ (X2SON)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance TBD 215.9 TBD 279.2 267.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD 143.2 TBD 172.6 128.5 °C/W
RθJB Junction-to-board thermal resistance TBD 76.6 TBD 154.6 188.9 °C/W
YJT Junction-to-top characterization parameter TBD 58.6 TBD 22.1 4.5 °C/W
YJB Junction-to-board characterization parameter TBD 76.2 TBD 153.8 188.4 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance TBD N/A TBD N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.