SLVS010V January   1976  – November 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: UA78L02
    6. 5.6  Electrical Characteristics: UA78L05
    7. 5.7  Electrical Characteristics: UA78L06
    8. 5.8  Electrical Characteristics: UA78L08
    9. 5.9  Electrical Characteristics: UA78L09
    10. 5.10 Electrical Characteristics: UA78L10
    11. 5.11 Electrical Characteristics: UA78L12
    12. 5.12 Electrical Characteristics: UA78L15
    13. 5.13 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Fixed-Output Mode
  7. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 System Examples
      1. 7.3.1 Positive Regulator in Negative Configuration
      2. 7.3.2 Current Limiter Circuit
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Related Links
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resource
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • PK|3
  • LP|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Layout

9.1 Layout Guidelines

Keep trace widths large enough to eliminate problematic I×R voltage drops at the input and output terminals. Bypass capacitors should be placed as close to the UA78L00 as possible. Additional copper and vias connected to ground facilitate additional thermal dissipation, preventing the device from reaching thermal overload.

9.2 Layout Example

UA78L02A UA78L05 UA78L05A UA78L06A UA78L08A UA78L09A UA78L10A UA78L12A UA78L15A LayoutExample.gif Figure 11. Example Layout for PK Package