SLUSE80A September   2021  – November 2021 UCC14240-Q1

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Power Ratings
    6. 6.6 Insulation Specifications
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Stage Operation
      2. 7.3.2 Digital I/O ENA and /PG
      3. 7.3.3 Power-Up and Power-Down Sequencing
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RLIM Resistor Selection
        2. 8.2.2.2 Capacitor Selection
    3. 8.3 System Examples
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DWN|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1)UCC14240-Q1UNIT
DWN (SOIC)
36 PINS
RθJAJunction-to-ambient thermal resistance

52.3

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

28.5

°C/W
RθJBJunction-to-board thermal resistance

25.9

°C/W
ψJTJunction-to-top characterization parameter

16.6

°C/W
ψJBJunction-to-board characterization parameter

25.6

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.