SLUSDX3C november   2020  – august 2023 UCC25800-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Management
      2. 8.3.2 Oscillator
      3. 8.3.3 External Synchronization
      4. 8.3.4 Dead-Time
        1. 8.3.4.1 Adaptive Dead-time
        2. 8.3.4.2 Maximum Programmable Dead-time
      5. 8.3.5 Protections
        1. 8.3.5.1 Overcurrent Protection
          1. 8.3.5.1.1 OCP Threshold Setting
          2. 8.3.5.1.2 Output Power Capability
        2. 8.3.5.2 Input Overvoltage Protection (OVP)
        3. 8.3.5.3 Over-Temperature Protection (TSD)
        4. 8.3.5.4 Pin-Fault Protections
        5. 8.3.5.5 VREG Pin Protection
      6. 8.3.6 DIS/FLT Pin operation
        1. 8.3.6.1 FAULT Codes
    4. 8.4 Device Functional Modes
      1. 8.4.1 UVLO Mode
      2. 8.4.2 Soft-start Mode
      3. 8.4.3 Normal Operation Mode
      4. 8.4.4 Disabled Mode
      5. 8.4.5 Fault Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 LLC Converter Operation Principle
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 What to Do and What Not to Do
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC –0.3 40 V
VREG –0.3 5.5 V
RT –0.3 5.5 V
DIS/FLT –0.3 5.5 V
SYNC –0.3 5.5 V
OC/DT –0.3 5.5 V
SW Pin voltage –1 VCC + 1 V
Current transient (100ns) –7 7 A
Voltage transient (50ns) higher of -5V or (VCC-41V) Lower of (VCC+5V) or 41V V
IQrms MOSFET RMS current 600 mA
TJ Junction temperature –40 150 °C
TAMB Ambient temperature -40 125 ℃
Tstg Storage temperature -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.