SLUSAT7F November 2011 – December 2014 UCC27210 , UCC27211
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
To improve the switching characteristics and efficiency of a design, the following layout rules should be followed.
Keep in mind that a poor layout can cause a significant drop in efficiency or system malfunction versus a good PCB layout and can even lead to decreased reliability of the whole system.
The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal characteristics of the package. In order for a gate driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The thermal metrics for the driver package is listed in Device Functional Modes. For detailed information regarding the table, please refer to the Application Note from Texas Instruments entitled IC Package Thermal Metrics (SPRA953). The UCC27210 and UCC27211 devices are offered in SOIC (8), PowerPad (8), WSON (10) or VSON (8). The Thermal Information section lists the thermal performance metrics related to SOT-23 package.