SLVSC90B August   2013  – August 2015 UCC27518A-Q1 , UCC27519A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VDD and Undervoltage Lockout
      2. 9.3.2 Operating Supply Current
      3. 9.3.3 Input Stage
      4. 9.3.4 Enable Function
      5. 9.3.5 Output Stage
      6. 9.3.6 Low Propagation Delays
    4. 9.4 Device Functional Modes
  10. 10 Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Input-to-Output Logic
        2. 10.2.2.2 Input Threshold Type
        3. 10.2.2.3 VDD Bias Supply Voltage
        4. 10.2.2.4 Peak Source and Sink Currents
        5. 10.2.2.5 Enable and Disable Function
        6. 10.2.2.6 Propagation Delay
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
    4. 12.4 Power Dissipation
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resource
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Supply voltage VDD –0.3 20 V
OUTA, OUTB voltage DC –0.3 VDD + 0.3 V
Repetitive pulse < 200 ns(5) –2 VDD + 0.3
Output continuous current IOUT_DC (source/sink) 0.3 A
Output pulsed current (0.5 µs) IOUT_pulsed (source/sink) 4 A
IN+, IN–, EN(4) –6 20 V
Operating virtual junction temperature, TJ –40 150 °C
Lead temperature Soldering, 10 s 300 °C
Reflow 260
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
(4) Maximum voltage on input pins is not restricted by the voltage on the VDD pin.
(5) Values are verified by characterization on bench

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V
Charged-device model (CDM), per AEC Q100-011 ±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage, VDD 4.5 12 18 V
Input voltage, (IN+ and IN–) and enable (EN) 0 18 V
Operating ambient temperature –40 140 °C

8.4 Thermal Information

THERMAL METRIC(1) UCC27518A-Q1
UCC27519A-Q1		 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 215.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 136.1 °C/W
RθJB Junction-to-board thermal resistance 43.2 °C/W
ψJT Junction-to-top characterization parameter 20.3 °C/W
ψJB Junction-to-board characterization parameter 42.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

VDD = 12 V, TA = –40°C to 140°C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the specified terminal.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BIAS CURRENTS
IDD(off) Startup current VDD = 3.4 V IN+ = VDD (UC27519A-Q1)
IN– = GND (UCC27518A-Q1)		 51 85 123 µA
IN– = VDD (UCC27518A-Q1) 51 70 103
IN+ = GND (UC27519A-Q1) 51 70 110
UNDERVOLTAGE LOCKOUT (UVLO)
VON Supply start threshold TA = 25°C 3.85 4.2 4.57 V
TA = –40°C to 140°C 3.8 4.2 4.67
VOFF Minimum operating voltage after supply start 3.45 3.9 4.35 V
VDD_H Supply voltage hysteresis 0.19 0.3 0.45 V
INPUTS (IN+, IN–)
VIN_H Input signal high threshold VDD = 4.5 V 55 62 %VDD
VIN_L Input signal low threshold 31 39
VIN_HYS Input signal hysteresis 16
VIN_H Input signal high threshold VDD = 12 V 55 59 %VDD
VIN_L Input signal low threshold 31 39
VIN_HYS Input signal hysteresis 16
VIN_H Input signal high threshold VDD = 18 V 55 58 %VDD
VIN_L Input signal low threshold 35 38
VIN_HYS Input signal hysteresis 17
ENABLE (EN)
VEN_H Enable signal high threshold VDD = 12 V 2.1 2.3 V
VEN_L Enable signal low threshold 1 1.25
VEN_HYS Enable hysteresis 0.86
SOURCE AND SINK CURRENT
ISRC/SNK Source/sink peak current(1) CLOAD = 0.22 µF, FSW = 1 kHz ±4 A
OUTPUTS (OUT)
VDD–VOH High output voltage VDD = 12 V
IOUT = –10 mA		 50 90 mV
VDD = 4.5 V
IOUT = –10 mA		 60 130
VOL Low output voltage VDD = 12
IOUT = 10 mA		 5 11 mV
VDD = 4.5 V
IOUT = 10 mA		 6 12
ROH Output pullup resistance(2) VDD = 12 V
IOUT = –10 mA		 5 7.5 Ω
VDD = 4.5 V
IOUT = –10 mA		 5.0 11
ROL Output pulldown resistance VDD = 12 V
IOUT = 10 mA		 0.5 1 Ω
VDD = 4.5 V
IOUT = 10 mA		 0.6 1.2
(1) Ensured by design.
(2) ROH represents on-resistance of P-channel MOSFET in pullup structure of the output stage of the UCC27518A-Q1 and UCC27519A-Q1 device.

8.6 Switching Characteristics

VDD = 12 V, TA = –40°C to 140°C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the specified terminal. Over operating free-air temperature range (unless otherwise noted). See the timing diagrams in Figure 1, Figure 2, Figure 3, and Figure 4.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR Rise time CLOAD = 1.8 nF 8 12 ns
tF Fall time CLOAD = 1.8 nF 7 11 ns
tD1 IN+ to output propagation delay VDD = 10 V
7-V input pulse, CLOAD = 1.8 nF		 6 17 25 ns
tD2 IN– to output propagation delay VDD = 10 V
7-V input pulse, CLOAD = 1.8 nF		 6 17 24 ns
tD3 EN to output high propagation delay CLOAD = 1.8 nF, 5-V enable pulse 4 12 16 ns
tD4 EN to output low propagation delay CLOAD = 1.8 nF, 5-V enable pulse 4 12 19 ns
UCC27518A-Q1 UCC27519A-Q1 time1_lusb33.gifFigure 1. Noninverting Configuration
(IN+ Pin, UCC27519A-Q1)
UCC27518A-Q1 UCC27519A-Q1 time2_lusb33.gifFigure 2. Inverting Configuration
(IN– Pin, UCC27518A-Q1)
UCC27518A-Q1 UCC27519A-Q1 time3_lusb33.gifFigure 3. Enable and Disable Function
(Noninverting Configuration, UCC27519A-Q1)
UCC27518A-Q1 UCC27519A-Q1 time4_lusb33.gifFigure 4. Enable and Disable Function
(Inverting Configuration, UCC27518A-Q1)

8.7 Typical Characteristics

UCC27518A-Q1 UCC27519A-Q1 G001_Startup Current_lusaw9.png
Figure 5. Start-Up Current vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G002_Operating Supply Current_lusaw9.png
Figure 7. Supply Current vs Temperature (Output in DC On/Off condition)
UCC27518A-Q1 UCC27519A-Q1 G001_VIHL_vs_Temp_lusb33.png
Figure 9. Input Threshold vs Temperature
UCC27518A-Q1 UCC27519A-Q1 fig11_lusay4.png
Figure 11. Output Pulldown Resistance vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G016_Fall Time_temp_lusaw9.png
Figure 13. Fall Time vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G010_IDD_frequency_lusaw9.png
Figure 15. Operating Supply Current vs Frequency
UCC27518A-Q1 UCC27519A-Q1 G009_Fall Time_lusaw9.png
Figure 17. Fall Time vs Supply Voltage
UCC27518A-Q1 UCC27519A-Q1 G013_Idd_500kHz_lusaw9.png
Figure 6. Operating Supply Current vs Temperature (Output Switching)
UCC27518A-Q1 UCC27519A-Q1 G003_UVLO_lusaw9.png
Figure 8. UVLO Threshold Voltage vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G004_Pull-Up Resistance_lusaw9.png
Figure 10. Output Pullup Resistance vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G015_Rise Time_temp_lusaw9.png
Figure 12. Rise Time vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G002_TDxx_vs_Temp_lusb33.png
Figure 14. Input To Output Propagation Delay vs Temperature
UCC27518A-Q1 UCC27519A-Q1 G008_Rise Time_lusaw9.png
Figure 16. Rise Time vs Supply Voltage