SLUSE26C
June 2021 – January 2022
UCC27614
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
6.7
Timing Diagrams
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
VDD Undervoltage Lockout
7.3.2
Input Stage
7.3.3
Enable Function
7.3.4
Output Stage
7.4
Device Functional Modes
8
Applications and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Driving MOSFET/IGBT/SiC MOSFET
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.2.1
Input-to-Output Configuration
8.2.1.2.2
Input Threshold Type
8.2.1.2.3
VDD Bias Supply Voltage
8.2.1.2.4
Peak Source and Sink Currents
8.2.1.2.5
Enable and Disable Function
8.2.1.2.6
Propagation Delay and Minimum Input Pulse Width
8.2.1.2.7
Power Dissipation
8.2.1.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
10.3
Thermal Consideration
11
Device and Documentation Support
11.1
Third-Party Products Disclaimer
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DSG|8
MPDS308C
Thermal pad, mechanical data (Package|Pins)
DSG|8
QFND141I
Orderable Information
sluse26c_oa
sluse26c_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.