SLUSE44C April   2020  – February 2023 UCC27624

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Supply Current
      2. 7.3.2 Input Stage
      3. 7.3.3 Enable Function
      4. 7.3.4 Output Stage
      5. 7.3.5 Low Propagation Delays and Tightly Matched Outputs
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 VDD and Undervoltage Lockout
        2. 8.2.2.2 Drive Current and Power Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The bias supply voltage range for the UCC27624 device is rated to operate is from 4.5 V to 26 V. The lower end of this range is governed by the internal undervoltage-lockout (UVLO) protection feature on the VDD pin supply circuit blocks. If the driver is in a UVLO condition when the VDD pin voltage is below the VDD UVLO turn-on (rising) threshold, the UVLO protection feature holds the output low, regardless of the status of the inputs. The upper end of this range is driven by the 30-V absolute maximum voltage rating of the VDD pin of the device (which is a stress rating). It is necessary to have sufficient margin from the absolute maximum rating of the device to realize full operating life of the device. Therefore, the upper limit of recommended voltage of the VDD pin is 26 V.

The UVLO protection feature also has a hysteresis function. This means, when the VDD pin bias voltage exceeds the rising threshold voltage, the device begins to operate normally. If the VDD bias voltage drops below the rising threshold while on, the device continues to deliver normal functionality unless the voltage drop exceeds the hysteresis specification of the falling threshold. Therefore, while operating at or near the 4.5-V, design engineer should ensure that the voltage ripple on the auxiliary power supply output is smaller than the hysteresis specification of the device. Otherwise, the device output may turn-off. During system shutdown, the device operation continues until the VDD pin voltage has dropped below the VDD turn-off (falling) threshold, which must be accounted for while evaluating system shutdown timing or sequencing requirements. At system startup, the device does not begin operation until the VDD pin voltage has exceeded VDD turn-on (rising) threshold.

The quiescent current consumed by the internal circuit blocks of the device is supplied through the VDD pin. Although this fact is well known, recognizing that the charge for source current pulses delivered by the OUTA/B pin is also supplied through the same VDD pin capacitor, is important. As a result, every time a current is sourced out of the output pins, a corresponding current pulse is delivered into the device through the VDD pin. Thus, ensure that the local bypass capacitors are provided between the VDD and GND pins and locate them as close to the device pins as possible for the purpose of decoupling. A low ESR, ceramic surface mount capacitor is required. TI recommends having two capacitors: a 0.1-μF ceramic surface-mount capacitor placed less than 1 mm from the VDD pin of the device and another larger ceramic capacitor (≥1 μF) must be connected in parallel.

UCC27624 is a high-current gate driver. If the gate driver is placed far from the switching power device, such as a MOSFET, then that could create a large inductive loop. A large inductive loop may cause excessive ringing on any and all pins of the gate driver. This may result in stress that exceeds device recommended ratings. Therefore, place the gate driver as close to the switching power device as possible. Also, use an external gate resistor to damp any ringing due to the high switching currents and board parasitic elements.