SLUSCW3
August 2017
UCC27712-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Simplified Schematic
5
Revision History
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Dynamic Electrical Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
VDD and Under Voltage Lockout
8.3.2
Input and Output Logic Table
8.3.3
Input Stage
8.3.4
Output Stage
8.3.5
Level Shift
8.3.6
Low Propagation Delays and Tightly Matched Outputs
8.3.7
Parasitic Diode Structure
8.4
Device Functional Modes
8.4.1
Minimum Input Pulse Operation
8.4.2
Output Interlock and Dead Time
8.4.3
Operation Under 100% Duty Cycle Condition
8.4.4
Operation Under Negative HS Voltage Condition
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
9.2.2.2
Selecting Bootstrap Capacitor (CBOOT)
9.2.2.3
Selecting VDD Bypass/Holdup Capacitor (CVDD) and Rbias
9.2.2.4
Selecting Bootstrap Resistor (RBOOT)
9.2.2.5
Selecting Gate Resistor RON/ROFF
9.2.2.6
Selecting Bootstrap Diode
9.2.2.7
Estimate the UCC27712-Q1 Power Losses (PUCC27712-Q1)
9.2.2.8
Estimating Junction Temperature
9.2.2.9
Operation With IGBT's
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Related Links
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sluscw3_oa
5
Revision History
DATE
REVISION
NOTES
August 2017
*
Initial release.