SLUSCR9B June 2017 – December 2020 UCC28730-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UCC28730-Q1 | UNIT | |
---|---|---|---|
D (SOIC) | |||
7 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 128.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 59.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 66.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 17.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 65.9 | °C/W |