SLUS829G August   2008  – February 2020 UCC2897A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Detailed Pin Descriptions
        1. 8.3.1.1  RDEL
        2. 8.3.1.2  RON
        3. 8.3.1.3  ROFF
        4. 8.3.1.4  VREF
        5. 8.3.1.5  SYNC
        6. 8.3.1.6  GND
        7. 8.3.1.7  CS
        8. 8.3.1.8  RSLOPE
        9. 8.3.1.9  FB
        10. 8.3.1.10 SS/SD
        11. 8.3.1.11 PGND
        12. 8.3.1.12 AUX
        13. 8.3.1.13 OUT
        14. 8.3.1.14 VDD
        15. 8.3.1.15 LINEUV
        16. 8.3.1.16 VIN
        17. 8.3.1.17 LINEOV
      2. 8.3.2 JFET Control and UVLO
      3. 8.3.3 Line Undervoltage Protection
      4. 8.3.4 Line Overvoltage Protection
      5. 8.3.5 Pulse Skipping
      6. 8.3.6 Synchronization
      7. 8.3.7 Gate Drive Connection
      8. 8.3.8 Bootstrap Biasing
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Oscillator
        2. 9.2.2.2 Soft Start
        3. 9.2.2.3 VDD Bypass Requirements
        4. 9.2.2.4 Delay Programming
        5. 9.2.2.5 Input Voltage Monitoring
        6. 9.2.2.6 Current Sense and Slope Compensation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (November 2017) to G Revision

  • Changed Modified Typical Application diagram Go
  • Changed Updated the RDEL1 calculationGo
  • Changed Updated the RDEL2 calculation Go

Changes from E Revision (April 2015) to F Revision

  • Changed Equation 1 From; tDEL2 = 11.1 × 10–2 To: tDEL2 = 11.1 × 10–12Go
  • Changed Equation 15 From: QG(main) x QG(aux) To: QG(main) + QG(aux) Go

Changes from D Revision (July 2009) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Changed Thermal Resistance Information table to new Thermal Information layout and updated PW and RGP package dataGo
  • Added RON and ROFF, RDEL test conditions to DMAX parameter in the PWM section of the Electrical Characteristics tableGo
  • Changed Oscillator equations in Step 1 for RON and ROFFGo