SLUS504H SEPTEMBER   2002  – January 2016 UCC27321 , UCC27322 , UCC37321 , UCC37322

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Power Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Source and Sink Capabilities during Miller Plateau
      4. 8.3.4 Enable
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-to-Output Configuration
        2. 9.2.2.2 Input Threshold Type
        3. 9.2.2.3 VDD Bias Supply Voltage
        4. 9.2.2.4 Peak Source and Sink Currents
        5. 9.2.2.5 Enable and Disable Function
        6. 9.2.2.6 Propagation Delay
        7. 9.2.2.7 Power Dissipation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Related Products
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

P, D, and DGN Packages
8-Pin PDIP, SOIC, and MSOP With PowerPAD
Top View
UCC27321 UCC27322 UCC37321 UCC37322 po_01_lus504.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
AGND 4 The AGND and the PGND must be connected by a single thick trace directly under the device. There must be a low ESR, low ESL capacitor of 0.1 µF between VDD (pin 8) and PGND and a separate 0.1-µF capacitor between VDD (pin 1) and AGND. The power MOSFETs must be located on the PGND side of the device while the control circuit must be on the AGND side of the device. The control circuit ground must be common with the AGND while the PGND must be common with the source of the power FETs.
ENBL 3 I Enable input for the driver with logic compatible threshold and hysteresis. The driver output can be enabled and disabled with this pin. It is internally pulled up to VDD with 100-kΩ resistor for active high operation. When the device is disabled, the output state is, low regardless of the input state.
IN 2 I Input signal of the driver which has logic compatible threshold and hysteresis.
OUT 6, 7 O Driver outputs that must be connected together externally. The output stage is capable of providing 9-A peak drive current to the gate of a power MOSFET.
PGND 5 Common ground for output stage. This ground must be connected very closely to the source of the power MOSFET which the driver is driving. Grounds are separated to minimize ringing affects due to output switching di/dt which can affect the input threshold.
VDD 1, 8 I Supply voltage and the power input connections for this device. Two pins must be connected together externally.