SLVSDD7A September   2016  – February 2019 UCD9090A


  1. Features
  2. Applications
  3. Description
    1.     Typical Application Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C/Smbus/PMBus Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TI Fusion GUI
      2. 7.3.2 PMBus Interface
      3. 7.3.3 Rail Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Supply Sequencing
        1. Turn-On Sequencing
        2. Turn-Off Sequencing
        3. Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Monitoring
        1. Voltage Monitoring
        2. Current Monitoring
        3. Remote Temperature Monitoring and Internal Temperature Sensor
        4. Temperature by Host Input
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. GPO Delays
        2. State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
        1. Fault Shutdown Rails
        2. Configured as Sequencing Debug Pin
        3. Configured as Fault Pin
        4. Cold Boot Mode Enable
      10. 7.4.10 Power Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. FPWM1-8
        2. PWM1-2
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. Open-Loop Margining
        2. Closed-Loop Margining
      15. 7.4.15 Run Time Clock
      16. 7.4.16 System Reset Signal
      17. 7.4.17 Watch Dog Timer
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
      21. 7.4.21 Device Reset
      22. 7.4.22 JTAG Interface
      23. 7.4.23 Internal Fault Management and Memory Error Correction (ECC)
    5. 7.5 Programming
      1. 7.5.1 Full Configuration Update While in Normal Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. Estimating ADC Reporting Accuracy
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Cold Boot Mode Enable

Cold boot mode is used to heat-up a system by turning on cold boot rails for certain amounts of time when it is under an extreme code temperature. UCD device is communicated with the system via particular GPI (thermal state GPI) which is output from a thermal device. Cold boot mode is only entering once per UCD reset. There is no system watch dog Reset during the cold boot mode.

Device reads the thermal state GPI to determine whether it should start cold boot or not when it is out of reset. When the input of thermal state GPI is DE-ASSERTED, device enters cold boot mode and log the GPI fault if the GPI fault log enable bit is set, otherwise device enters normal mode. The following changes on the thermal state GPI do not introduce any logging. Only one GPI can be assigned for this function and one it is assigned, it cannot be used for any other GPI functions.

The rails used in the cold boot mode are configurable. For those rails with Sequence On Dependency on the thermal state GPI, they (non-cold boot rails) are not powered-up during the cold boot since the dependency is not met. But non-cold boot rails will be power-on under normal mode since thermal state GPI is treated as ASSERTED when cold boot mode is over. For those rails without sequence on dependency on the thermal state GPI, they (cold boot rails) are power-on under both cold boot and normal mode. It is application’s responsibility to set the proper ON_OFF_CONFIG for those cold boot rails. Cold boot rails are not power-on if their ON_OFF_CONFIG settings are not met under cold boot mode. Cold boot mode timeout is used to tell how long the device shall stay at the cold boot before it stops monitoring the thermal state GPI and shutdown all cold boot rails with EN control. Normal Boot Start Delay is used to tell how long device should wait to ramp up the powers after all cold boot rails with EN are below POWER_GOOD_OFF.


- If system temperature is < threshold degree C (Thermal State GPI) o Yes(DE_ASSERTED): § Log GPI fault § Start Cold Boot Timeout § No System Watchdog output § Ramp up the power supplies based on ON_OFF_CONFIG § Wait for thermal state GPI ASSERTED OR “Cold Boot Mode Timeout expired” § Disable the thermostat input listening mode § Force to shutdown down all cold boot rails with EN control immediately § Wait all cold boot rails with EN control below POWER_GOOD_OFF § Start and Wait “Normal boot Start Delay expired” - Disable the thermostat input listening mode - Treated Thermal State GPI as ASSERTED - Ramp up power supplies based on ON_OFF_CONFIG