SLRS027P December   1976  – August 2019 ULN2002A , ULN2003A , ULN2003AI , ULN2004A , ULQ2003A , ULQ2004A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: ULN2002A
    6. 6.6  Electrical Characteristics: ULN2003A and ULN2004A
    7. 6.7  Electrical Characteristics: ULN2003AI
    8. 6.8  Electrical Characteristics: ULN2003AI
    9. 6.9  Electrical Characteristics: ULQ2003A and ULQ2004A
    10. 6.10 Switching Characteristics: ULN2002A, ULN2003A, ULN2004A
    11. 6.11 Switching Characteristics: ULN2003AI
    12. 6.12 Switching Characteristics: ULN2003AI
    13. 6.13 Switching Characteristics: ULQ2003A, ULQ2004A
    14. 6.14 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Inductive Load Drive
      2. 8.4.2 Resistive Load Drive
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Drive Current
        2. 9.2.2.2 Low-Level Output Voltage
        3. 9.2.2.3 Power Dissipation and Temperature
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Dissipation and Temperature

The number of coils driven is dependent on the coil current and on-chip power dissipation. The number of coils driven can be determined by Figure 4 or Figure 5.

For a more accurate determination of number of coils possible, use the below equation to calculate ULN2003A device on-chip power dissipation PD:

Equation 2. ULN2002A ULN2003A ULN2003AI ULQ2003A ULN2004A ULQ2004A eq1_lrs059.gif

where

  • N is the number of channels active together
  • VOLi is the OUTi pin voltage for the load current ILi. This is the same as VCE(SAT)

To ensure reliability of ULN2003A device and the system, the on-chip power dissipation must be lower that or equal to the maximum allowable power dissipation (PD(MAX)) dictated by below equation Equation 3.

Equation 3. ULN2002A ULN2003A ULN2003AI ULQ2003A ULN2004A ULQ2004A eq2_lrs059.gif

where

  • TJ(max) is the target maximum junction temperature
  • TA is the operating ambient temperature
  • RθJA is the package junction to ambient thermal resistance

Limit the die junction temperature of the ULN2003A device to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation.