SWRS170L March   2014  – May 2025 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 7.9  WLAN Performance: 5GHz Transmitter Power
    10. 7.10 WLAN Performance: Currents
    11. 7.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 7.12 Bluetooth Performance: Transmitter, BR
    13. 7.13 Bluetooth Performance: Transmitter, EDR
    14. 7.14 Bluetooth Performance: Modulation, BR
    15. 7.15 Bluetooth Performance: Modulation, EDR
    16. 7.16 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    17. 7.17 Bluetooth Low Energy Performance: Transmitter Characteristics
    18. 7.18 Bluetooth Low Energy Performance: Modulation Characteristics
    19. 7.19 Bluetooth BR and EDR Dynamic Currents
    20. 7.20 Bluetooth Low Energy Currents
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Power Management
        1. 7.21.1.1 Block Diagram – Internal DC-DCs
      2. 7.21.2 Power-Up and SHUTDOWN States
      3. 7.21.3 Chip Top-level Power-Up Sequence
      4. 7.21.4 WLAN Power-Up Sequence
      5. 7.21.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.21.6 WLAN SDIO Transport Layer
        1. 7.21.6.1 SDIO Timing Specifications
        2. 7.21.6.2 SDIO Switching Characteristics – High Rate
      7. 7.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.21.7.1 UART 4-Wire Interface – H4
      8. 7.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1837MOD Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Detailed Description

The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology.

Figure 8-1 shows a high-level view of the WL1837MOD variant.

WL1807MOD WL1837MOD WL1837MOD High-Level System DiagramFigure 8-1 WL1837MOD High-Level System Diagram

 

Table 8-1, Table 8-2, and Table 8-3 list performance parameters along with shutdown and sleep currents.

Table 8-1 WLAN Performance Parameters
WLAN(1)CONDITIONSSPECIFICATION (TYP)UNIT
Maximum TX power, 5GHz (OFDM6)6Mbps OFDM18dBm
Maximum TX power, 2.4GHz (1DSSS)1Mbps DSSS16.5dBm
Minimum sensitivity, 5GHz (OFDM6)6Mbps OFDM –92.5dBm
Minimum sensitivity, 2.4GHz (1DSSS)1Mbps DSSS–95dBm
Sleep currentLeakage, firmware retained160µA
Connected IDLENo traffic IDLE connect750µA
RX search2.4GHz SISO 2058mA
RX current (SISO20)MCS7, 2.4GHz69mA
RX current (SISO20)MCS7, 5GHz77mA
TX current (SISO20)MCS7, 2.4GHz238mA
TX current (SISO20)MCS7, 5GHz324mA
Maximum peak current consumption during calibration(2)850mA
(1) The system design power scheme must comply with both peak and average TX bursts.
(2) Peak current VBAT can hit 850mA during device calibration.
  • At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4GHz band.
  • After a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned.
  • The maximum VBAT value is based on peak calibration consumption with a 30% margin.
Table 8-2 Bluetooth Performance Parameters
BLUETOOTHCONDITIONSSPECIFICATION (TYP)UNIT
Maximum TX powerGFSK11.7dBm
Minimum sensitivityGFSK–92.2dBm
Sniff1 attempt, 1.28s (+4dBm)178µA
Page or inquiry1.28s interrupt, 11.25ms scan window (+4dBm)253µA
A2DPMP3 high quality 192kbps (+4dBm)7.5mA
Table 8-3 Shutdown and Sleep Currents
PARAMETERPOWER SUPPLY CURRENTTYPUNIT
Shutdown mode
All functions shut down		VBAT10µA
VIO2
WLAN sleep modeVBAT160µA
VIO60
Bluetooth sleep modeVBAT110µA
VIO60