SWRS170L March   2014  – May 2025 WL1807MOD , WL1837MOD

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  External Digital Slow Clock Requirements
    5. 7.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 7.6  WLAN Performance: 2.4GHz Receiver Characteristics
    7. 7.7  WLAN Performance: 2.4GHz Transmitter Power
    8. 7.8  WLAN Performance: 5GHz Receiver Characteristics
    9. 7.9  WLAN Performance: 5GHz Transmitter Power
    10. 7.10 WLAN Performance: Currents
    11. 7.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 7.12 Bluetooth Performance: Transmitter, BR
    13. 7.13 Bluetooth Performance: Transmitter, EDR
    14. 7.14 Bluetooth Performance: Modulation, BR
    15. 7.15 Bluetooth Performance: Modulation, EDR
    16. 7.16 Bluetooth Low Energy Performance: Receiver Characteristics – In-Band Signals
    17. 7.17 Bluetooth Low Energy Performance: Transmitter Characteristics
    18. 7.18 Bluetooth Low Energy Performance: Modulation Characteristics
    19. 7.19 Bluetooth BR and EDR Dynamic Currents
    20. 7.20 Bluetooth Low Energy Currents
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Power Management
        1. 7.21.1.1 Block Diagram – Internal DC-DCs
      2. 7.21.2 Power-Up and SHUTDOWN States
      3. 7.21.3 Chip Top-level Power-Up Sequence
      4. 7.21.4 WLAN Power-Up Sequence
      5. 7.21.5 Bluetooth-Bluetooth Low Energy Power-Up Sequence
      6. 7.21.6 WLAN SDIO Transport Layer
        1. 7.21.6.1 SDIO Timing Specifications
        2. 7.21.6.2 SDIO Switching Characteristics – High Rate
      7. 7.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 7.21.7.1 UART 4-Wire Interface – H4
      8. 7.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  9. 8 Detailed Description
    1. 8.1 WLAN Features
    2. 8.2 Bluetooth Features
    3. 8.3 Bluetooth Low Energy Features
    4. 8.4 Device Certification
      1. 8.4.1 FCC Certification and Statement
      2. 8.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 8.4.3 ETSI/CE
      4. 8.4.4 MIC Certification
    5. 8.5 Module Markings
    6. 8.6 Test Grades
    7. 8.7 End Product Labeling
    8. 8.8 Manual Information to the End User
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Application Information
      1. 9.1.1 Typical Application – WL1837MOD Reference Design
      2. 9.1.2 Design Recommendations
      3. 9.1.3 RF Trace and Antenna Layout Recommendations
      4. 9.1.4 Module Layout Recommendations
      5. 9.1.5 Thermal Board Recommendations
      6. 9.1.6 Baking and SMT Recommendations
        1. 9.1.6.1 Baking Recommendations
        2. 9.1.6.2 SMT Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Tools and Software
      3. 10.1.3 Device Support Nomenclature
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 TI Module Mechanical Outline
    2. 12.2 Tape and Reel Information
      1. 12.2.1 Tape and Reel Specification
      2. 12.2.2 Packing Specification
        1. 12.2.2.1 Reel Box
        2. 12.2.2.2 Shipping Box
    3. 12.3 Packaging Information
      1. 12.3.1 PACKAGE OPTION ADDENDUM

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.5 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads.

TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 9-5).

WL1807MOD WL1837MOD Block of Ground Pads on Bottom Side of PackageFigure 9-5 Block of Ground Pads on Bottom Side of Package

Figure 9-6 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads.

WL1807MOD WL1837MOD Via Array PatternsFigure 9-6 Via Array Patterns