SWRS170I August   2014  – October 2017 WL1807MOD , WL1837MOD


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  External Digital Slow Clock Requirements
    5. 5.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 5.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 5.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 5.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 5.9  WLAN Performance: 5-GHz Transmitter Power
    10. 5.10 WLAN Performance: Currents
    11. 5.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 5.12 Bluetooth Performance: Transmitter, BR
    13. 5.13 Bluetooth Performance: Transmitter, EDR
    14. 5.14 Bluetooth Performance: Modulation, BR
    15. 5.15 Bluetooth Performance: Modulation, EDR
    16. 5.16 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals
    17. 5.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 5.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 5.19 Bluetooth BR and EDR Dynamic Currents
    20. 5.20 Bluetooth low energy Currents
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Power Management
        1. Block Diagram - Internal DC-DCs
      2. 5.21.2 Power-Up and Shut-Down States
      3. 5.21.3 Chip Top-level Power-Up Sequence
      4. 5.21.4 WLAN Power-Up Sequence
      5. 5.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 5.21.6 WLAN SDIO Transport Layer
        1. SDIO Timing Specifications
        2. SDIO Switching Characteristics - High Rate
      7. 5.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. UART 4-Wire Interface - H4
      8. 5.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN Features
    2. 6.2 Bluetooth Features
    3. 6.3 Bluetooth low energy Features
    4. 6.4 Device Certification
      1. 6.4.1 FCC Certification and Statement
      2. 6.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 6.4.3 ETSI/CE
      4. 6.4.4 MIC Certification
    5. 6.5 Module Markings
    6. 6.6 Test Grades
    7. 6.7 End Product Labeling
    8. 6.8 Manual Information to the End User
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1837MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. Baking Recommendations
        2. SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. Tools and Software
      3. 8.1.3 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Tape and Reel Information
      1. 9.2.1 Tape and Reel Specification
      2. 9.2.2 Packing Specification
        1. Reel Box
        2. Shipping Box
    3. 9.3 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)

Device and Documentation Support

Device Support

Third-Party Products Disclaimer


Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

Tools and Software

For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Design Kits and Evaluation Modules

    AM335x EVM (TMDXEVM3358) The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation.
    AM437x Evaluation Module (TMDSEVM437X) The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals.
    BeagleBone Black Development Board (BEAGLEBK) BeagleBone Black is a low-cost, open source, community-supported development platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on Sitara™ AM335x ARM Cortex-A8 processor development in less than 5 minutes using just a single USB cable.
    WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B) The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply).

    Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM.

    WL18XXCOM82SDMMC Adapter Board The WiLink SDIO board is an SDMMC adapter board and an easy-to-use connector between the WiLink COM8 EVM (WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437.

TI Designs and Reference Designs

The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematics or block diagrams, BOMs, and design files to speed your time to market.

    TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay® receiver, full audio stack streaming, support for online music services, and much more. This TI Design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software.
    2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDC-WL1835MODCOM8B) The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications.
    Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY) The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards (ZigBee® and BLE).
    Streaming Audio Reference Design (TIDEP0009) The TIDEP0009 Streaming Audio Reference Design minimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level.


    WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP) The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits (SDKs) that use similar toolchain on other platforms.
    Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA) Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today.
    Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA) Linux SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer.
    TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK) TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request.
    Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML (TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.
    TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified (QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request.
    WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool (RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool (BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues.

Development Tools

Device Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices.

WL1807MOD WL1837MOD DEVICE_NOMENCLATURE.gif Figure 8-1 Device Nomenclature
X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: “This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device.
null Device is qualified and released to production. TI’s standard warranty applies to production devices.

Related Links

Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8-1 Related Links

WL1807MOD Click here Click here Click here Click here Click here
WL1837MOD Click here Click here Click here Click here Click here

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.


WiLink, E2E are trademarks of Texas Instruments.

ARM is a registered trademark of ARM Physical IP, Inc.

Airplay is a registered trademark of Apple Inc.

Bluetooth is a registered trademark of Bluetooth SIG.

Android is a trademark of Google, Inc.

IEEE Std 802.11 is a trademark of IEEE.

Linux is a registered trademark of Linus Torvalds.

Sitara is a trademark of TI.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

ZigBee is a registered trademark of ZigBee Alliance.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.


SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.