SWRS170I August   2014  – October 2017 WL1807MOD , WL1837MOD

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Attributes
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  External Digital Slow Clock Requirements
    5. 5.5  Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 5.6  WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 5.7  WLAN Performance: 2.4-GHz Transmitter Power
    8. 5.8  WLAN Performance: 5-GHz Receiver Characteristics
    9. 5.9  WLAN Performance: 5-GHz Transmitter Power
    10. 5.10 WLAN Performance: Currents
    11. 5.11 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    12. 5.12 Bluetooth Performance: Transmitter, BR
    13. 5.13 Bluetooth Performance: Transmitter, EDR
    14. 5.14 Bluetooth Performance: Modulation, BR
    15. 5.15 Bluetooth Performance: Modulation, EDR
    16. 5.16 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals
    17. 5.17 Bluetooth low energy Performance: Transmitter Characteristics
    18. 5.18 Bluetooth low energy Performance: Modulation Characteristics
    19. 5.19 Bluetooth BR and EDR Dynamic Currents
    20. 5.20 Bluetooth low energy Currents
    21. 5.21 Timing and Switching Characteristics
      1. 5.21.1 Power Management
        1. 5.21.1.1 Block Diagram - Internal DC-DCs
      2. 5.21.2 Power-Up and Shut-Down States
      3. 5.21.3 Chip Top-level Power-Up Sequence
      4. 5.21.4 WLAN Power-Up Sequence
      5. 5.21.5 Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 5.21.6 WLAN SDIO Transport Layer
        1. 5.21.6.1 SDIO Timing Specifications
        2. 5.21.6.2 SDIO Switching Characteristics - High Rate
      7. 5.21.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.21.7.1 UART 4-Wire Interface - H4
      8. 5.21.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN Features
    2. 6.2 Bluetooth Features
    3. 6.3 Bluetooth low energy Features
    4. 6.4 Device Certification
      1. 6.4.1 FCC Certification and Statement
      2. 6.4.2 Innovation, Science, and Economic Development Canada (ISED)
      3. 6.4.3 ETSI/CE
      4. 6.4.4 MIC Certification
    5. 6.5 Module Markings
    6. 6.6 Test Grades
    7. 6.7 End Product Labeling
    8. 6.8 Manual Information to the End User
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1837MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Tools and Software
      3. 8.1.3 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Tape and Reel Information
      1. 9.2.1 Tape and Reel Specification
      2. 9.2.2 Packing Specification
        1. 9.2.2.1 Reel Box
        2. 9.2.2.2 Shipping Box
    3. 9.3 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOC|100
Thermal pad, mechanical data (Package|Pins)

Revision History

Changes from November 18, 2016 to October 31, 2017

  • Changed FeaturesGo
  • Changed Bluetooth 4.1 to Bluetooth 4.2 Go
  • Added Bluetooth 4.2 secure connection compliance in FeaturesGo
  • Changed package information in Device Information tableGo
  • Changed note in Absolute Maximum RatingsGo
  • Added Device Certification and Qualification sectionGo
  • Changed Module Markings sectionGo
  • Added End Product Labeling sectionGo
  • Added Device Nomenclature image Go
  • Changed package type in Package Option AddendumGo