SBOS375D October   2006  – October 2024 XTR111

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Dynamic Performance
      3. 6.3.3 External Current Limit
      4. 6.3.4 External MOSFET
      5. 6.3.5 Output Error Flag and Disable Input
      6. 6.3.6 Voltage Regulator
      7. 6.3.7 Level Shift of 0V Input and Transconductance Trim
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Error Flag Delay
      3. 7.1.3 Voltage Output Configuration
      4. 7.1.4 4mA-to-20mA Output
    2. 7.2 Typical Applications
      1. 7.2.1 0mA–20mA Voltage-to-Current Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package and Heat Dissipation
        2. 7.4.1.2 Thermal Pad Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configurations and Functions

Figure 4-1 DGQ Package, 10-Pin HVSSOP
(Top View)
Figure 4-2 DRC Package, 10-Pin VSON
(Top View)
Table 4-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 VSP Power Positive supply
2 IS Output Source connection
3 VG Output Gate drive
4 REGS Input Regulator sense
5 REGF Output Regulator force
6 VIN Input Input voltage
7 SET Input Transconductance set
8 EF Output Error flag (active low)
9 OD Input Output disable (active high)
10 GND Ground Negative supply
Pad Thermal pad — Connect exposed thermal pad to GND