SBOSAL6A June   2025  – September 2025 XTR200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Explanation of Pin Functions
      2. 6.3.2 Using an External Transistor
      3. 6.3.3 Error Flag
    4. 6.4 Device Functional Modes
      1. 6.4.1 Current-Output Mode
      2. 6.4.2 Voltage-Output Mode
      3. 6.4.3 Output Disabled
      4. 6.4.4 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input Voltage
      2. 7.1.2 Miswiring Protection
      3. 7.1.3 Power Dissipation in Current Output Mode
      4. 7.1.4 Estimating Junction Temperature
    2. 7.2 Typical Applications
      1. 7.2.1 Analog Output Circuit for Field Transmitters
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Additional Applications
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1.     53
    2. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

at TA = 25°C, VSP = 24V, Current-Output Mode: RSET = 1.5kΩ, RL = 250Ω, CL = 10pF, Voltage-Output Mode: RL = 1kΩ, CL = 10pF unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
Input voltage range 0 5 V
VOS Input offset voltage ±200 ±800 µV
TA = –40°C to +125°C  ±1000
dVOS/dT Input offset voltage drift TA = –40°C to +125°C  ±0.5 ±3 µV/°C
PSRR Power supply rejection ratio ±0.4 ±2 µV/V
TA = –40°C to +125°C  ±3
IB Input bias current VIN = 3V   ±5   pA
VIN = 5V TA = –40°C to +105°C    5 nA

VIN = 3V
 		 TA = –40°C to +125°C    10 nA
ZIN Input impedance 50 || 7 GΩ || pF
en Input voltage noise density f = 1kHz Current-output mode   53   nV/√Hz
Voltage-output mode   34  
Input voltage noise f = 0.1Hz to 10Hz Current-output mode   7.6   µVp-p
Voltage-output mode   4  
In Input current noise density f = 1kHz   3   fA/√Hz
CURRENT OUTPUT
IOUT Output current equation IOUT = 10 * (VIN / RSET)
Output current headroom VSP = 8V IOUT = 25mA 2.2 2.3 V
Output current, linear range 0.01 25 mA
RO Output resistance 47 GΩ
ILEAK Output leakage Output Disabled 0.35 nA
TA = –40°C to +125°C 10
dIO/dT Output current drift(1) TA = –40°C to +125°C IOUT = 4mA ±6 ±35 nA/℃
IOUT = 20mA ±15 ±60
Nonlinearity IOUT from 0.1mA to 25mA ±0.001 ±0.003 %
Span error(2) IOUT from 0.1mA to 25mA ±0.01 ±0.065 %
TA = –40°C to +125°C ±0.07 %
VSP from 12V to 40V ±0.0001 ±0.0003 %/V
Span error drift TA = –40°C to +125°C ±1 ±2 ppm/℃
IOS Offset current(3) VIN = 0V ±2 ±10 µA
IOUT = 4mA ±2 ±12
TA = –40°C to +125°C ±14
dIOS/dVS Offset current vs supply IOUT = 4mA VSP from 12V to 40V ±6 ±30 nA/V
VOLTAGE OUTPUT
VOUT Output voltage equation VOUT = VIN * 3.75
Output voltage headroom VOUT = 10V IOUT = 25mA 2.15 2.3 V
Maximum output voltage VIN = 5V 18.75 V
Minimum output voltage VIN = 0V 0.4 3 mV
TA = –40°C to +125°C 4
Gain error VOUT from 10mV to 10V ±0.007 ±0.04 %
TA = –40°C to +125°C ±0.05 %
Gain error drift TA = –40°C to +125°C ±0.1 ±0.5 ppm/℃
Nonlinearity VOUT from 10mV to 10V ±0.00025 ±0.0006 %
ILIM Short circuit current limit 30 40 45 mA
TA = –40°C to +125°C 49
DYNAMIC RESPONSE
Small signal bandwidth Current-output mode 3 MHz
Voltage-output mode 260 kHz
Slew rate Current-output mode 5.5 mA/µs
Voltage-output mode 1 V/µs
ERROR FLAG
Output voltage Logic Low 0.3 0.8 V
Logic High 3.15 3.3 4 V
Current-sinking capability 3 mA
Internal pull-up current 4 µA
Thermal warning temperature EF Output Low 145 150 155 ℃
MODE
Input logic threshold (high) Current-output mode 1.3 1.65 V
Input logic threshold (low) Voltage-output mode 0.8 1.3 V
Internal pull-up current 4 µA
OUTPUT DISABLE
Input logic threshold (high) Output Disabled 1.3 1.65 V
Input logic threshold (low) Output Enabled 0.8 1.3 V
Internal pullup current 4 µA
POWER SUPPLY
IQ Quiescent current Current-output mode 325 450 μA
TA = –40°C to 125°C 550
(1) Does not include initial error or TCR of RSET.
(2) Span is the change in output current resulting from a full-scale change in input voltage
(3) Offset current is the deviation from the current ratio of ISET to IOUT