SLLSEU7C November   2018  – October 2022 ISO7760-Q1 , ISO7761-Q1 , ISO7762-Q1 , ISO7763-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
      1.      Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient temperature range
    • Device HBM ESD classification level 3A
    • Device CDM ESD classification level C6
  • Functional Safety-Capable
  • 100 Mbps data rate
  • Robust isolation barrier:
    • >100-Year projected lifetime
    • Up to 5000 VRMS isolation rating
    • Up to 12.8 kV surge capability
    • ±100 kV/μs Typical CMTI
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V Level translation
  • Default output high (ISO776x) and low (ISO776xF) Options
  • Low power consumption, typical 1.4 mA per channel at 1 Mbps
  • Low propagation delay: 11 ns typical at 5 V
  • Robust Electromagnetic Compatibility (EMC):
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 Contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16) and SSOP (DBQ-16) package options
  • Safety-related certifications:
    • Reinforced insulation per DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • CSA certification per IEC 62368-1 and IEC 60601-1

    • CQC certification per GB4943.1

    • TUV certification according to EN 62368-1 and EN 61010-1