SLLSFK1C September   2021  – April 2022 ISOW7740 , ISOW7741 , ISOW7742 , ISOW7743 , ISOW7744

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics - Power Converter
    10. 7.10 Supply Current Characteristics - Power Converter
    11. 7.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
    12. 7.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
    13. 7.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    14. 7.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    15. 7.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    16. 7.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    17. 7.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    18. 7.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    19. 7.19 Switching Characteristics - 5-V Supply
    20. 7.20 Switching Characteristics - 3.3-V Supply
    21. 7.21 Switching Characteristics - 2.5-V Supply
    22. 7.22 Switching Characteristics - 1.8-V Supply
    23. 7.23 Insulation Characteristics Curves
    24. 7.24 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Power Isolation
      2. 9.1.2 Signal Isolation
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 9.3.2 Power-Up and Power-Down Behavior
      3. 9.3.3 Protection Features
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
      4. 10.2.4 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DFM|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • 100 Mbps data rate
  • Integrated DC-DC converter with low-emissions, low-noise
    • Emission optimized to meet CISPR 32 and EN 55032 Class B with >5 dB margin on 2 layer board
    • Low frequency power converter at 25 MHz enabling low noise performance
    • Low output ripple: 24 mV
  • High efficiency output power
    • Efficiency at max load: 46%
    • Up to 0.55-W output power
    • VISOOUT accuracy of 5%
    • 5 V to 5 V: Max available load current = 110 mA
    • 5 V to 3.3 V: Max available load current = 140 mA
    • 3.3 V to 3.3 V: Max available load current = 60 mA
  • Independent power supply for channel isolator & power converter
    • Logic supply (VIO): 1.71-V to 5.5-V
    • Power converter supply (VDD): 3-V to 5.5-V
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
  • Reinforced and Basic isolation options
  • High CMTI: 100-kV/µs (typical)
  • Safety Related Certifications:
    • VDE reinforced and basic insulation per DIN VDE V 0884-11:2017-01
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1-2011 certifications
    • ISOW774xB devices are planned
  • Extended temperature range: –40°C to +125°C
  • 20-pin wide body SOIC package