JAJSKN9A november   2020  – march 2023 ALM2403-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overtemperature and Shutdown Pin (OTF/SH_DN)
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Current-Limit and Short-Circuit Protection
      4. 7.3.4 Input Common-Mode Range
      5. 7.3.5 Reverse Body Diodes in Output-Stage Transistors
      6. 7.3.6 EMI Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open-Loop and Closed-Loop Operation
      2. 7.4.2 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resolver Excitation Amplifier Combined With MFB 2nd-Order, Low-Pass Filter
          1. 8.2.2.1.1 Filter Design
          2. 8.2.2.1.2 Short-to-Battery Protection
        2. 8.2.2.2 Power Dissipation and Thermal Reliability
          1. 8.2.2.2.1 Improving Package Thermal Performance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報
8.2.2.2.1 Improving Package Thermal Performance

The value of RθJA depends on the printed circuit board (PCB) layout. An external heat sink, a cooling mechanism such as a cold air fan, or both, can help reduce RθJA, and thus improve device thermal capabilities. See TI’s design support web page at www.ti.com/thermal for general guidance on improving device thermal performance.