DLPS119B December   2018  – May 2022 DLP2010NIR


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Physical Characteristics of the Micromirror Array
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
      1. 6.13.1 Software Requirements
    14. 6.14 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Optical Interface and System Image Quality
        1. Numerical Aperture and Stray Light Control
        2. Pupil Match
        3. Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
      3. 11.1.3 Device Markings
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information



  • FQJ|40

Micromirror Array Optical Characteristics

Micromirror tilt angle DMD landed state(1) 17 degrees
Micromirror tilt angle tolerance(1) (2) (4) (5) (6) –1.4 1.4 degrees
Micromirror tilt direction(3) (7) Landed ON state 180 degrees
Landed OFF state 270
Micromirror crossover time Typical Performance 1.5 4 μs
Micromirror switching time Typical Performance 6
Image performance(8) Bright pixel(s) in active area (9) Gray 10 Screen (10) 0 micromirrors
Bright pixel(s) in the POM (11) Gray 10 Screen (10) 1
Dark pixel(s) in the active area (12) White Screen 4
Adjacent pixel(s) (13) Any Screen 0
Unstable pixel(s) in active area (14) Any Screen 0
Measured relative to the plane formed by the overall micromirror array.
Additional variation exists between the micromirror array and the package datums.
When the micromirror array is landed (not parked), the tilt direction of each individual micromirror is dictated by the binary contents of the CMOS memory cell associated with each individual micromirror. A binary value of 1 results in a micromirror landing in the ON State direction. A binary value of 0 results in a micromirror landing in the OFF State direction.
Represents the landed tilt angle variation relative to the nominal landed tilt angle.
Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different devices.
For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations or system contrast variations.
Micromirror tilt direction is measured as in a typical polar coordinate system: measuring counter-clockwise from a 0° reference which is aligned with the +X Cartesian axis.
Conditions of Acceptance: All DMD image quality returns will be evaluated using the following projected image test conditions:
       Test set degamma shall be linear
       Test set brightness and contrast shall be set to nominal
       The diagonal size of the projected image shall be a minimum of 20 inches
       The projections screen shall be 1X gain
       The projected image shall be inspected from a 38 inch minimum viewing distance
       The image shall be in focus during all image quality tests
Bright pixel definition: A single pixel or mirror that is stuck in the ON position and is visibly brighter than the surrounding pixels
Gray 10 screen definition: All areas of the screen are colored with the following settings:
      Red = 10/255
      Green = 10/255
      Blue = 10/255
POM definition: Rectangular border of off-state mirrors surrounding the active area
Dark pixel definition: A single pixel or mirror that is stuck in the OFF position and is visibly darker than the surrounding pixels
Adjacent pixel definition: Two or more stuck pixels sharing a common border or common point, also referred to as a cluster
Unstable pixel definition: A single pixel or mirror that does not operate in sequence with parameters loaded into memory. The unstable pixel appears to be flickering asynchronously with the image
Figure 6-17 Landed Pixel Orientation and Tilt