DLPS206 May   2021 DLPC7540

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  DMD HSSI Electrical Characteristics
    8. 6.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 6.9  V-by-One Interface Electrical Characteristics
    10. 6.10 FPD-Link LVDS Electrical Characteristics
    11. 6.11 USB Electrical Characteristics
    12. 6.12 System Oscillator Timing Requirements
    13. 6.13 Power Supply and Reset Timing Requirements
    14. 6.14 DMD HSSI Timing Requirements
    15. 6.15 DMD Low-Speed LVDS Timing Requirements
    16. 6.16 V-by-One Interface General Timing Requirements
    17. 6.17 FPD-Link Interface General Timing Requirements
    18. 6.18 Source Frame Timing Requirements
    19. 6.19 Synchronous Serial Port Interface Timing Requirements
    20. 6.20 Master and Slave I2C Interface Timing Requirements
    21. 6.21 Programmable Output Clock Timing Requirements
    22. 6.22 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    23. 6.23 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    24. 6.24 Multi-Trace ETM Interface Timing Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 Processing Delays
      3. 7.3.3 FPD-Link Interface
      4. 7.3.4 V-by-One interface
      5. 7.3.5 DMD (HSSI) Interface
      6. 7.3.6 Program Memory Flash Interface
      7. 7.3.7 GPIO Supported Functionality
      8. 7.3.8 Debug Support
    4. 7.4 Device Operational Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
        2. 7.4.2.2 Low Latency Configuration
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
    1. 9.1 Power Supply Management
    2. 9.2 Hot Plug Usage
    3. 9.3 Power Supplies for Unused Input Source Interfaces
    4. 9.4 Power Supplies
      1. 9.4.1 1.15-V Power Supplies
      2. 9.4.2 1.21V Power Supply
      3. 9.4.3 1.8-V Power Supplies
      4. 9.4.4 3.3-V Power Supplies
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  General Layout Guidelines
      2. 10.1.2  Power Supply Layout Guidelines
      3. 10.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 10.1.4  Layout Guideline for DLPC7540 Reference Clock
        1. 10.1.4.1 Recommended Crystal Oscillator Configuration
      5. 10.1.5  V-by-One Interface Layout Considerations
      6. 10.1.6  FPD-Link Interface Layout Considerations
      7. 10.1.7  USB Interface Layout Considerations
      8. 10.1.8  DMD Interface Layout Considerations
      9. 10.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 10.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 10.2 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Package Data
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
      1. 11.4.1 Video Timing Parameter Definitions
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
PARAMETERTOLERANCEMINNOMMAXUNIT
V(VDD115) (Core)1.15-V Power± 4.35% tolerance1.101.151.20V
V(VDD115_PLLMA) (Core)1.15-V Digital Power - MCG-A PLL
(Master Clock Generator)
+4.35/-9.13% tolerance1.0451.151.20V
V(VDD115_PLLMB) (Core)1.15-V Digital Power - MCG-B PLL
(Master Clock Generator)
+4.35/-9.13% tolerance1.0451.151.20V
V(VDD115_PLLS) (Core)1.15-V Analog Power - SCG Doubler PLL+4.35/-9.13% tolerance1.0451.151.20V
V(VAD115_FPD) (Core)1.15-V Analog Power - FPD+4.35/-9.13% tolerance1.0451.151.20V
V(VAD115_VX1) (Core)1.15-V Analog Power - VX1+4.35/-9.13% tolerance1.0451.151.20V
V(VAD115_HSSI) (Core)1.15-V Analog Power - HSSI+4.35/-9.13% tolerance1.0451.151.20V
ΔV(VAD115_HSSI) (Core)pk-pkVAD115_HSSI supply noise @ 10 MHz (sine)20mV
V(VAD115_HSSI0_PLL) (Core)1.15-V Analog Power - HSSI0 PLL+4.35/-9.13% tolerance1.0451.151.20V
ΔV(VAD115_HSSI0_PLL) (Core)pk-pkVAD115_HSSI0_PLL supply noise @ 10 MHz (sine)20mV
V(VAD115_HSSI1_PLL) (Core)1.15-V Analog Power - HSSI1 PLL+4.35/-9.13% tolerance1.0451.151.20V
ΔV(VAD115_HSSI1_PLL) (Core)pk-pkVAD115_HSSI1_PLL supply noise @ 10 MHz (sine)20mV
V(VDD121_SCS) (Core)1.21V Digital Power - SCS DRAM+7.43/-4.95% tolerance1.151.211.30V
V(VAD18_PLLMA) (Core)1.8-V Analog Power - MCG-A PLL
(Master Clock Generator)
±5.0% tolerance1.711.801.89V
V(VAD18_PLLMB) (Core)1.8-V Analog Power - MCG-B PLL
(Master Clock Generator)
±5.0% tolerance1.711.801.89V
V(VAD18_VX1) (I/O)1.8-V Analog Power - VX1 Interface±5.0% tolerance1.711.801.89V
V(VDD18_SCS) (Core)1.8-V Digital Power - SCS DRAM±5.0% tolerance1.711.801.89V
V(VDD18_LVDS) (I/O)1.8-V Analog Power - DMD LS Interface±5.0% tolerance1.711.801.89V
V(VDD33) (I/O)3.3-V Digital Power - (All 3.3-V I/O without dedicated 3.3-V supply - e.g. GPIO)±5.0% tolerance3.1353.33.465V
V(VAD33_OSCA) (I/O)3.3-V Analog Power - Crystal-OSCA Interface±5.0% tolerance3.1353.33.465V
V(VAD33_OSCB) (I/O)3.3-V Analog Power - Crystal-OSCB Interface±5.0% tolerance3.1353.33.465V
V(VDD33_FPD) (I/O)3.3-V Digital Power - FPD interface±5.0% tolerance3.1353.33.465V
V(VAD33_USB) (I/O)3.3-V Analog Power - USB Interface±5.0% tolerance3.1353.33.465V
V(VDD33_HSSI) (I/O)3.3-V Digital Power - DMD HSSI Interface±5.0% tolerance3.1353.33.465V
ΔV(VDD33_HSSI) (I/O)pk-pkVDD33_HSSI supply noise @ 10 MHz (sine)60mV
GENERAL
TJOperating junction temperature0115°C
TCOperating case temperature0108°C
TAOperating ambient temperature (1)(2)055°C
The operating ambient temperature range values were determined based on the board design parameters described in Section 10.1.1 , rather than using a JEDEC JESD51 standard test card and environment, along with min and max estimated power dissipation across process, voltage, and temperature. Ambient thermal conditions, which impact RθJA, vary by application. Thus, maximum operating ambient temperature varies by application.
  1. Ta_min = Tj_min – (Pd_min × RθJA) = 0°C – (host_min_valueW × host_value°C/W) = –host_calculated_value°C
  2. Ta_max = Tj_max – (Pd_max × RθJA) = +115°C – (host_max_valueW × host_value°C/W) = +host_calculated_value°C
Operating ambient temperature is dependent on system thermal design. Operating case temperature cannot exceed its specified range across ambient temperature conditions.