DLPS206 May   2021 DLPC7540

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Electrical Characteristics
    6. 6.6  Pin Electrical Characteristics
    7. 6.7  DMD HSSI Electrical Characteristics
    8. 6.8  DMD Low-Speed LVDS Electrical Characteristics
    9. 6.9  V-by-One Interface Electrical Characteristics
    10. 6.10 FPD-Link LVDS Electrical Characteristics
    11. 6.11 USB Electrical Characteristics
    12. 6.12 System Oscillator Timing Requirements
    13. 6.13 Power Supply and Reset Timing Requirements
    14. 6.14 DMD HSSI Timing Requirements
    15. 6.15 DMD Low-Speed LVDS Timing Requirements
    16. 6.16 V-by-One Interface General Timing Requirements
    17. 6.17 FPD-Link Interface General Timing Requirements
    18. 6.18 Source Frame Timing Requirements
    19. 6.19 Synchronous Serial Port Interface Timing Requirements
    20. 6.20 Master and Slave I2C Interface Timing Requirements
    21. 6.21 Programmable Output Clock Timing Requirements
    22. 6.22 JTAG Boundary Scan Interface Timing Requirements (Debug Only)
    23. 6.23 JTAG ARM Multi-Ice Interface Timing Requirements (Debug Only)
    24. 6.24 Multi-Trace ETM Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Sources
      2. 7.3.2 Processing Delays
      3. 7.3.3 FPD-Link Interface
      4. 7.3.4 V-by-One interface
      5. 7.3.5 DMD (HSSI) Interface
      6. 7.3.6 Program Memory Flash Interface
      7. 7.3.7 GPIO Supported Functionality
      8. 7.3.8 Debug Support
    4. 7.4 Device Operational Modes
      1. 7.4.1 Standby Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Normal Configuration
        2. 7.4.2.2 Low Latency Configuration
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Management
    2. 9.2 Hot Plug Usage
    3. 9.3 Power Supplies for Unused Input Source Interfaces
    4. 9.4 Power Supplies
      1. 9.4.1 1.15-V Power Supplies
      2. 9.4.2 1.21V Power Supply
      3. 9.4.3 1.8-V Power Supplies
      4. 9.4.4 3.3-V Power Supplies
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  General Layout Guidelines
      2. 10.1.2  Power Supply Layout Guidelines
      3. 10.1.3  Layout Guidelines for Internal Controller PLL Power
      4. 10.1.4  Layout Guideline for DLPC7540 Reference Clock
        1. 10.1.4.1 Recommended Crystal Oscillator Configuration
      5. 10.1.5  V-by-One Interface Layout Considerations
      6. 10.1.6  FPD-Link Interface Layout Considerations
      7. 10.1.7  USB Interface Layout Considerations
      8. 10.1.8  DMD Interface Layout Considerations
      9. 10.1.9  General Handling Guidelines for Unused CMOS-Type Pins
      10. 10.1.10 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
    2. 10.2 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Device Markings
        2. 11.1.2.2 Package Data
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
      1. 11.4.1 Video Timing Parameter Definitions
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

Over operating free-air temperature (unless otherwise noted)(1)
SUPPLY VOLTAGE(2)MINMAXUNIT
V(VDD115) (Core)–0.31.6V
V(VDD115_PLLMA) (Core)–0.31.6V
V(VDD115_PLLMB) (Core)–0.31.6V
V(VDD115_PLLS) (Core)–0.31.6V
V(VAD115_FPD) (Core)–0.31.6V
V(VAD115_VX1) (Core)–0.51.5V
V(VAD115_HSSI) (Core)–0.31.6V
V(VAD115_HSSI0_PLL) (Core)–0.31.6V
V(VAD115_HSSI1_PLL) (Core)–0.31.6V
V(VDD121_SCS) (Core)–0.41.6V
V(VAD18_PLLMA) (Core)–0.32.5V
V(VAD18_PLLMB) (Core)–0.32.5V
V(VAD18_VX1) (I/O)–0.52.5V
V(VDD18_SCS) (Core)–0.42.3V
V(VDD18_LVDS) (I/O)–0.32.5V
V(VDD33) (I/O)–0.33.9V
V(VAD33_OSCA) (I/O)–0.33.9V
V(VAD33_OSCB) (I/O)–0.33.9V
V(VDD33_FPD) (I/O)–0.33.9V
V(VAD33_USB) (I/O)–0.33.9V
V(VDD33_HSSI) (I/O)–0.33.9V
GENERAL
TJOperating junction temperature0115°C
TCOperating case temperature0108(3)°C
IlatLatch-up–100100mA
TstgStorage temperature range-40125°C
(1) Stresses beyond those listed under Section 6.1 can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3. Exposure to absolute-maximum-rated conditions for extended periods ca affect device reliability.
(2) All voltage values are with respect to GND.
(3) Value calculated using package parameters defined in Section 6.4.